Network Members

ECPE Contact:
Prof. Dr. Mike Meinhardt

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ECPE Contact:
Prof. Dr. E. J. DEDE

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ECPE Contact:
Eric Guiot 

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ECPE Contact:
Daniel Scheidecker

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ECPE Contact:
Manuel Gärtner

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ECPE Contact:
Elisabeth Gulden 

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ECPE Contact:
Klaus Neumeier

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ECPE Contact:
Endo Masashi

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About Sumitomo Bakelite Co., Ltd.

Sumitomo Bakelite Co., Ltd. is a functional chemical products manufacturer specializing in high-value-added plastics. The company operates in a wide range of fields.

Our power electronics product lineup includes semiconductor encapsulants, which hold the world's No.1 market share. Additionally, our wide range of materials, are adopted by numerous devices, reflecting our highly acclaimed technological expertise.

We have leveraged the high quality of our products as well as our extensive track record to expand our presence in power electronics-related products.

We have established bases in various regions around the world. In Europe, we operate three sites across Belgium and Spain. At Sumitomo Bakelite Europe (Ghent) NV, located in Ghent, Belgium, we integrate manufacturing, sales, and R＆D, primarily focusing on products for power electronics applications. Additionally, this site features an open lab that enables the manufacturing and evaluation of materials tailored to customer designs, allowing us to meet even the most specific requirements.

Product Introduction

• Encapsulant for Power Modules【EME Series】
  The EME series is widely used as an encapsulant for semiconductor packages,  power modules with heat dissipation, heat resistance, and high adhesion. It features a glass transition temperature (Tg) of over 200℃, thermal conductivity of 5–10 W/(m·K), and high insulation performance. 
   
• High Thermal Conductivity Ag Paste【CRM Series】
  The CRM series is a die-bonding paste for semiconductors, designed to support a wide range of packages, from general packages to thin and large ones we offer semi-sintering Ag paste with a thermal conductivity 15-150 W/(m·K), Through a resin formulation technology, the elastic modulus is kept low, enabling the CRM series to serve as a reliable and highly thermally conductive material (TIM2) for bonding power modules and coolers.
   
• Photosensitive Wafer Coating Resin【CRC Series】
  The CRC series is a photosensitive wafer coating resin for semiconductors, widely adopted by our customers. As a photosensitive wafer coating material, it offers numerous features such as high resolution, strong adhesion, low water absorption of less than 0.5%, and environmental safety.
   
• Liquid Epoxy Cast Molding Resin for Power Modules【ECR Series】
  The ECR series is used as casting material for case-type modules and has been highly regarded by a wide range of customers. With high Tg, low α, and low ε properties, it enhances reliability, low viscosity and filler sedimentation suppression improve workability and productivity at the customer’s site.
   

In addition, we also offer a lineup of high thermal conductivity insulating sheets with a thermal conductivity of 18 W/m·K class for power modules, insulating substrates, and substrate materials for chip embedding substrates.

ECPE Contact:
Dr. Besar Asllani

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ECPE Contact:
Raffaele Vignieri

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ECPE Contact:
Dr. Stefan Weber

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ECPE Contact:
Mahmoud Wahby

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ECPE Contact:
César Do Monte

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ECPE Contact:
Florian Reiners

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ECPE Contact:
Dr. Georges Tchouangue

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ECPE Contact:
Athanasios Korres

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ECPE Contact:
Dietmar Klien

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ECPE Contact:
Damjan Tomanek

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ECPE Contact:
Dr. Holger Schwenk

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