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Young Engineer and Innovation Awards

Every year at CIPS and PCIM Europe Conference, ECPE awards young engineers for outstanding work in the field of power electronics and sponsors the associated prize money. In addition, ECPE and the Semikron Foundation have been awarding the Semikron Young Engineer and Innovation Award since 2012. All activities are part of the "Young Engineers Needed" programme. 
Moreover ECPE is sponsor of the Best Poster Award in the frame of the European PhD School.

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Sabrina Haberl
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ECPE Young Engineer Award at CIPS Conference

Since 2010, ECPE sponsors the Young Engineer Award at CIPS Conference. Its presented to exceptional contributions from young professionals. The winner receives prize money and is invited to present the paper at the Conference.

 

 

2018

2018

The winner of the Young Engineer Award at CIPS Conference 2018 sponsored by ECPE is:

  • Christina DiMarino (Center of Power Electronic Systems (CPES)): Her paper is about 'Fabrication and Characterization of a High-Power- Density, Planar 10 kV SiC MOSFET Power Modulea'. 

Archive

  • 2016

    The winner of the Young Engineer Award at CIPS Conference 2016 sponsored by ECPE is:
     

    • Daniel Kearney (ABB Corporate Research Centre & ABB Schweiz AG)
      'PCB Embedded Power Electronics for Low Voltage Applications'

     

     

  • 2014

    The Young Engineer Award at CIPS Conference 2014 sponsored by ECPE was split between two winners:

    • Bianca Böttge (Fraunhofer IWM)
      'High Resolution failure analysis of silver-sintered contact interfaces for power electronics'
       
    • Dr. Christian R. Müller (Infineon)
      'Low-inductive Inverter concept by 200A/1200V half bridge in EasyPack 2B – following strip-line design'. 
  • 2012

    The winners of the Young Engineer Award at CIPS Conference 2012 sponsored by ECPE are:

    • Silke Kraft (Fraunhofer IISB)
      'Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications'.
       
    • Gernot J. Riedel (ABB Switzerland Corporate Research)
      'Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modelling and Experimental Results'.
  • 2010

    The winner of the Young Engineer Award at CIPS Conference 2010 sponsored by ECPE is :

    • Jens Göhre (Fraunhofer IZM)
      'Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling Measured by the Shear Test'.

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Landgrabenstrasse 94
D-90443 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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