ECPE Young Engineer Award at CIPS Conference

The winner of the Young Engineer Award at CIPS Conference 2016 sponsored by ECPE is:
 

• Daniel Kearney (ABB Corporate Research Centre & ABB Schweiz AG)
  'PCB Embedded Power Electronics for Low Voltage Applications'

The Young Engineer Award at CIPS Conference 2014 sponsored by ECPE was split between two winners:

• Bianca Böttge (Fraunhofer IWM)
  'High Resolution failure analysis of silver-sintered contact interfaces for power electronics'
   
• Dr. Christian R. Müller (Infineon)
  'Low-inductive Inverter concept by 200A/1200V half bridge in EasyPack 2B – following strip-line design'. 

The winners of the Young Engineer Award at CIPS Conference 2012 sponsored by ECPE are:

• Silke Kraft (Fraunhofer IISB)
  'Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications'.
   
• Gernot J. Riedel (ABB Switzerland Corporate Research)
  'Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modelling and Experimental Results'.

The winner of the Young Engineer Award at CIPS Conference 2010 sponsored by ECPE is :

• Jens Göhre (Fraunhofer IZM)
  'Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling Measured by the Shear Test'.