IEEE ESTC - Electronics System-Integration Technology Conference

Call for Papers - Abstract submission opens: 1 December 2025 | Abstract submission deadline: 1 March 2026

The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. The 11th IEEE ESTC will be taking place in Helsinki, Finland.

Conference Topics:

• Advanced Packaging
• Materials for Interconnects and Packaging
• Optoelectronic Systems Packaging
• Assembly and Manufacturing Technologies
• Design Tools and Modeling
• Power Electronics System Packaging
• Advanced Technologies for Emerging Systems
• Reliability of Electronic Devices and Systems
• Flexible, Printed and Hybrid Electronics
• RF, mm-wave and THz Systems Packaging

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