THERMAL 2027 - European Advanced Technology Workshop on Micropackaging and Thermal Management - CALL FOR PAPERS

Call for Papers - Deadline: 5 January 2027

The call for papers of the 20th Advanced Technology Workshop on Micropackaging and Thermal Management that will be held in La Rochelle on March 17th and 18th, 2027 is published. This yearly conference has grown year after year by the number of presented papers and attendees. Be part of a successful 2027 edition and be sure to submit your abstract on time. The workshop sessions will include the following topics. Papers are invited in following areas: 

• Cooling solutions for microelectronics packaging and advanced electronic systems
• Thermal challenges in advanced packaging, chiplets, 2.5D/3D integration, HBM and heterogeneous systems
• Thermal management for AI, HPC, data centers, GPUs, accelerators and high-power servers
• Thermal interface materials, heat conductive materials and interface reliability
• Direct-to-chip liquid and immersion cooling, microchannel/manifold cooling and two-phase cooling
• Heat sinks, heat pipes, vapor chambers and phase change materials
• Advances in PCBs, embedded components and substrate-level thermal management
• Thermal modeling, CFD, digital twins, machine learning and AI-based optimization
• Thermal management of photonics, optical interconnects, co-packaged optics and optoelectronic components
• Power electronics, automotive, aerospace and harsh-environment thermal management

• Thermal characterization, test vehicles, in-situ sensing, IR thermography and reliability under thermal cycling

   

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