IWIPP 2027 - International Workshop on Integrated Power Packaging - CALL FOR PAPERS

Call for Papers Deadline Extended: October 23, 2026

IWIPP is a conference designed to bring the greatest packaging and systems minds together to discuss the hardest issues facing our industry. We want to learn from you, hear your questions, and discuss your latest findings. Nowhere else is there a workshop with such diversified organizational sponsors, making IWIPP an opportunity to learn something big. Established in 1998 by Professor Shenai of the University of Illinois, IWIPP has focused on advanced power packaging and integration technologies that maximize the performance of power semiconductor devices. With the rapid expansion of AI data centers and electric vehicles, these technologies have become more important than ever. IWIPP 2027 will bring together researchers and engineers from around the world to discuss the latest developments in the field.
As in IWIPP 2025, IEEE PELS, IEEE EPS, IEEE DEIS, and PSMA serve as financial sponsors of IWIPP 2027, and ECPE serves as a technical co-sponsor.

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