ISTFA 2025

The symposium will explore cutting-edge topics such as the challenges and solutions in heterogeneous integration, advanced packaging techniques, and the role of failure analysis in ensuring the reliability of next-generation microelectronics. Participants can expect to gain valuable perspectives on how to navigate the complexities of these advanced technologies, enabling them to drive innovation in their respective fields. With a focus on both theoretical and practical applications, ISTFA 2025 promises to be an invaluable platform for professionals looking to enhance their expertise and stay at the forefront of microelectronics testing and failure analysis.

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