THERMAL 2026 - European Advanced Technology Workshop on Micropackaging and Thermal Management

This yearly conference has grown year after year by the number of presented papers and attendees. Be part of a successful 2026 edition and be sure to submit your abstract on time. The workshop sessions will include the following topics. Papers are invited in following areas:

• Cooling solutions for microelectronics packaging,
• Heat conductive materials at chip, board, sub-system and system levels,
• Advances in PCBs for thermal management, PCB embedded components included,
• Heatsinks, heat pipes and change phase materials,
• Liquid and phase change cooling,
• Thermal modeling and simulation, Machine Learning and AI optimization,
• Innovative cooling solutions,
• Thermal management of optoelectronics components (LEDs, IR sensors…),
• Overviews or examples of products, systems cooling, power electronics, automotive transport,
• Temperature-related or thermal cycles-related reliability of electronic components

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