European Projects, FP7

FP7 - Modular Interposer System Architecture Providing Scalable Heat Removal, Power Delivery and Optical Signaling (CarrICool)

Date: 01/01/2014 - 31/12/2016

Coordinator: 
IBM Research GmbH 

Consortium:

  • Eidgenössische Technische Hochschule Zürich 
  • AMIC Angewandte Micro-Messtechnik GmbH
  • Fraunhofer Gesellschaft zur Förderung der Angewandten Forschung e.v. 
  • Technische Universität Chemnitz 
  • Murata Integrated Passive Solutions 
  • University College Cork - National University of Ireland, Cork 
  • Siec Badawacza Lukasiewicz - Instytut Technologil Elektronowej 
  • Alter Technology TUV Nord UK Limited 

Volume:
5,8 Mio. €


Project:
Available packaging solutions cannot support 3D integration density scaling and Beyond-CMOS devices, constraining systemability with respect to energy efficiency, reliability, and  computational performance – the key metrics in the many-core, exascale and post-CMOS era. CarrICool demonstrates the smart implementation and the robust manufacturability of advanced More-than-Moore components into a modular and scalable interposer, supporting System-on-Chip and System-in-Package evolution.

 


Cordis Website

FP7 - Modular Interposer System Architecture Providing Scalable Heat Removal, Power Delivery and Optical Signaling (CarrICool)

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