FP7 - Modular Interposer System Architecture Providing Scalable Heat Removal, Power Delivery and Optical Signaling (CarrICool)

Coordinator: 
IBM Research GmbH 

Consortium:

• Eidgenössische Technische Hochschule Zürich 
• AMIC Angewandte Micro-Messtechnik GmbH
• Fraunhofer Gesellschaft zur Förderung der Angewandten Forschung e.v. 
• Technische Universität Chemnitz 
• Murata Integrated Passive Solutions 
• University College Cork - National University of Ireland, Cork 
• Siec Badawacza Lukasiewicz - Instytut Technologil Elektronowej 
• Alter Technology TUV Nord UK Limited 

Volume:
5,8 Mio. €

Project:
Available packaging solutions cannot support 3D integration density scaling and Beyond-CMOS devices, constraining systemability with respect to energy efficiency, reliability, and  computational performance – the key metrics in the many-core, exascale and post-CMOS era. CarrICool demonstrates the smart implementation and the robust manufacturability of advanced More-than-Moore components into a modular and scalable interposer, supporting System-on-Chip and System-in-Package evolution.

Cordis Website