European Projects, EU HORIZON 2020

EU HORIZON 2020 - MOBILITY FOR GROWTH: Integrated, Intelligent modular power electronic converter (I2MPECT)

Date: 01/05/2015 - 01/05/2018

Siemens AG


  • Airbus S.A.S.
  • Airbus Group Innovations
  • Dynex Semiconductor Ltd.
  • Institut National des Sciences Appliquées de Lyon / Centre d´Energétique et de Thermique de Lyon / Laboratoire Ampère 
  • Eidgenössische Technische Hochschule Zürich 
  • Safran Labinal Power Systems 
  • University of Sheffield 
  • K&S Projektmanagement 

7,1 Mio. € 

Increasingly demanding requirements in the transportation industry for higher efficiency and reduced carbon footprint are leading to an ever increasing interest in electrically operated drives which offer significant benefits over their pneumatic or hydraulic counterparts. More electric aircraft technologies with fully electrical actuation and environmental conditioning systems are moving from topics of academic interest to commercial applications.
Despite the progress in power electronics and electrical drives, significant advances in power density and reliability are still required before electrical technologies are fully accepted in the aircraft industry. The thermal management of losses generated in the power converters, with the associated requirements for heavy cooling systems, is proving to be the stumbling block for further improvements in power density. Ground-breaking advances in wide band-gap semiconductor materials are promising to deliver significant benefits to power conversion systems with unprecedented levels of power density thanks to considerably reduced losses and high temperature operation, making them ideal building blocks for aerospace power electronics. Leveraging on some of EU best expertise in device manufacture and packaging, components integration, thermal management, converters design, reliability analysis, control and condition monitoring, as well as aircraft power systems, the proposal will demonstrate significant advances of the state of the art in power converters for harsh environments.Innovative 3D device packaging based on planar interconnect Technologies with double-sided integrated cooling, will be demonstrated for wide band-gap wire-bond free power semiconductor devices. These technological breakthroughs, coupled with novel methodologies for active thermal management, lifetime testing, health management and prognosis will contribute to unprecedented levels of power density, efficiency and reliability in aerospace application.


I2MPECT Website

General information

EU HORIZON 2020 - MOBILITY FOR GROWTH: Integrated, Intelligent modular power electronic converter (I2MPECT)

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

Subscribe to the ECPE News


© 2018 ECPE European Center for Power Electronics e.V.