The field of power electronics packaging poses complex and multidisciplinary challenges. Diverse aspects such as thermal management, mechanical design, electromagnetic issues, materials and interconnect technologies strongly influence system cost, reliability, performance and size.

This first ECPE seminar will present packaging issues that power electronics designers, manufacturers and users come across in various applications, and it will provide an overview of the state-of-the-art and emerging technologies in the field.

The main goal of this seminar is to offer high-level education and information to participants, as well as create a proper environment for discussing the challenges in this multidisciplinary field. At the end of the seminar, we expect that both high and low power packaging approaches benefit from the synergies existing between each other.

Dr. Amina Hamidi (ABB) will chair the seminar with support from Mr. Thomas Harder (ECPE).

All presentations and discussions will be in English.