Advanced materials are the key to many innovations in power electronics e.g. in packaging and inter-connection technologies, in thermal management as well as in active and passive component technology.

Therefore, we decided to select this important cross-functional topic for our ECPE Seminar held in the frame of the ECPE Annual Event 2009.

In power electronics the different materials in use are often stressed to their load limits. High power density is requiring excellent thermal conductivity, normally in combination with electrical insulation. The high voltages are challenging the dielectric properties, high currents ask for excellent electrical conductivity. Many different materials are needed in a power electronic system to meet all these often conflicting requirements. This leads to additional stresses resulting from the thermo-mechanics under electrical and thermal load cycles.

On the other side, materials and their manufac­turability strongly influence the costs of components and assemblies in power electronics.

Prof. Martin Maerz (Fraunhofer IISB in Erlangen/Nurem­berg) will chair the seminar together with Mr. Thomas Harder (ECPE).

All presentations and discussions will be in English.