Workshop

ECPE Workshop: Mechatronic System Integration

Date: 01/10/2009

Location: Paris, France

Technical Chair:

Prof. Dr. B. Allard, INSA de Lyon - SEEDS ISP3D
Dr. G.-M. Martin, MOVEO/Valeo
T. Harder, ECPE

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ECPE Workshop: Mechatronic System Integration

Mechatronic System Integration:

Key driver for Mechatronic System Integration are the severe space, weight and also cost  restrictions in emerging applications e.g. in automotive and aerospace. Classic power electronics in the cabinet designs cannot be transferred but power electronics has to be integrated in the mechanical system to optimise the use of space, to avoid expensive cables and fault-prone connectors and to reduce EMI filter complexity. On the other side, the power electronics components and assemblies are exposed to extreme loads in terms of temperature, temperature cycling and vibration. The thermal design of the overall system is very important in power mechatronics taking into account the requirements on reliability and lifetime Mechatronic integration means that  mechanics, power electronics, sensors and control have to form a single functional unit. Traditional interfaces between electronics and mechanics must be dissolved. However, the great challenge with any approach of mechatronic integration is that it must be effective, not only with respect to system size, but also in terms of system costs, functionality, manufacturability, testability and reliability.

Dr. G.-M. Martin (Valeo) who is heading the Mechatronics activities in the French automotive cluster MOVEO will chair the workshop together with Thomas Harder (ECPE).

All presentations and discussions will be in English.

Workshop

ECPE Workshop: Mechatronic System Integration

Date: 01/10/2009

Location: Paris, France

Technical Chair:

Prof. Dr. B. Allard, INSA de Lyon - SEEDS ISP3D
Dr. G.-M. Martin, MOVEO/Valeo
T. Harder, ECPE

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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