Substrates are key components in power electronics assemblies as they have to provide multiple functions as mechanical carrier as well as for electrical interconnection enabling high currents, electrical insulation providing high breakdown voltages and high thermal conductivity to remove the dissipated heat. Even with the ultra-high efficiencies of todays power electronic systems, the losses are considerable and must be transferred via a heat sink to the ambient. And a higher level of integration with increasing power densities is leading to higher operation temperatures up to 200°C in some applications.

The choice of a substrate material and technology is defining the reliability of a power electronic system due to the thermo-mechanical properties under thermal cycling load.

Apart from the substrate performance, costs is of course an issue for the choice of the right substrate in a specific application. Starting from state of the art Direct Bonded Copper substrates, alternative materials and technologies for ceramic based substrates, insulated metal substrates, PCB based solutions and new approaches using sprayed metal and insulation layers will be presented and discussed.

Furthermore, the process compatibility e.g. regarding soldering, sintering and wire bonding will be discussed together with basic failure modes and reliability aspects.

The workshop is chaired by Dr. M. Rittner (Robert Bosch) together with T. Harder and J. Koszescha (ECPE).

All presentations and discussions will be in English.

There will be a tabletop exhibition in the frame of the workshop.