Workshop

ECPE Workshop: Thermal and Reliability Modelling and Simulation of PE Components and Systems

Date: 30/11/2016 - 01/12/2016

Location: Fuerth / Nuremberg, Germany

Technical Chair:

Prof. Eckhard Wolfgang, ECPE
Dr. Markus Thoben, Infineon
Prof. Bernhard Wunderle, Technical University Chemnitz

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ECPE Workshop: Thermal and Reliability Modelling and Simulation of PE Components and Systems

This Workshop will be the second one on "lifetime modelling and simulation" under given mission profiles. The first happened to be in July 2013 at Dusseldorf with 150 attendees. It was followed by "Intelligent Reliability Testing" in December 2014 with 120 attendees.

Thermal engineering with simulation of power electronic systems is a key to achieve high performance and reliability. After a review of the basic theory of heat transfer, and loss calculation, different thermal simulation approaches will be addressed including equivalent thermal network calculation, finite element modelling (FEM) and CFD simulations for fluid dynamics.
Lifetime modelling and simulation is an important part of the SAE J1211 Robustness Validation procedure. It is based on the Physics-of-Failure approach which means that appropriate models are a prerequisite for lifetime simulation. In addition the different stresses which are applied during operation have to be considered (mission profiles).

The workshop will present and discuss the state-of-the-art of thermal and reliability simulation in the field of power electronics. Of course models have to be calibrated by experiments.
For better understanding and to stimulate discussions there will be a table top exhibition.

Following companies take part in the exhibition: ADAM Research, Adapted Solution, DfR Solutions/RELNETxY, Mentor Graphics, Plexim.

The workshop is chaired by Prof. Eckhard Wolfgang (ECPE), Dr. Markus Thoben (Infineon), and Prof. Bernhard Wunderle (Technical University Chemnitz).

All presentations and discussions will be in English language.

Proceedings

Workshop

ECPE Workshop: Thermal and Reliability Modelling and Simulation of PE Components and Systems

Date: 30/11/2016 - 01/12/2016

Location: Fuerth / Nuremberg, Germany

Technical Chair:

Prof. Eckhard Wolfgang, ECPE
Dr. Markus Thoben, Infineon
Prof. Bernhard Wunderle, Technical University Chemnitz

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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