The field of power electronics packaging poses complex and multidisciplinary challenges. Diverse aspects such as thermal management, mechanical design, EMC issues, materials and interconnect technologies strongly influence system cost, reliability, performance and size.
This ECPE Workshop will present packaging issues that power electronics designers, manufacturers and users come across in various applications, and it will provide an overview of the state-of-the-art and emerging technologies in the field.
Furthermore, the workshop will formulate recommended research direction of power electronics packaging to enable superior converter performance for future medium and high power applications. It will exploit the presence of key experts from research & industry and ECPE’s facilitator role to align research activities to future industrial needs.
This workshop will have a strong focus on power electronics applications and their future requirements for packaging technology, in particular also MV and HV applications will be covered e.g. wind & hydro power, HVDC, smart grids, etc.

The ECPE Workshop “Power Electronics Packaging” is chaired by Prof. Mark Johnson (University of Nottingham), Mr Jürgen Schuderer (ABB Switzerland) and Mr Thomas Harder (ECPE).

All presentations and discussions will be in English