Workshop

ECPE Workshop: Failure Analysis Tools for Wide Band-Gap Devices

Date: 16/10/2014 - 17/10/2014

Location: Rouen, France

Technical Chair:

Prof. Bruno Allard, INSA de Lyon
Dr. Olivier Latry, GPM University of Normandy
Dipl.-Phys. Thomas Harder, ECPE e.V.

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ECPE Workshop: Failure Analysis Tools for Wide Band-Gap Devices

This workshop is dedicated to failure analysis tools and methods in power electronics. The main purpose is to give practical cases with non-destructive methods and destructive methods. During the two days, some equipment will be presented like de-packaging process, photo-emission microscopy (PEM), laser stimulation (OBIRCH), …as non-destructive method and Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM) analysis as destructive methods.
These are key know-hows for reliability study of wide bang gap devices in power electronic applications. Some live demonstrations on equipment are scheduled depending on the number of participants (remote video-based demonstrations as back-up).
Examples concern but not exclusively the electrostatic discharge in Schottky diode, presented in order to illustrate the entire methodology. Other cases should be discussed in front of Posters.

The workshop is chaired by Prof. Bruno Allard (Ampere Insa Lyon), Dr. Olivier Latry (GPM University of Normandy) and Thomas Harder (ECPE)

All presentations and discussions will be in English.

Workshop

ECPE Workshop: Failure Analysis Tools for Wide Band-Gap Devices

Date: 16/10/2014 - 17/10/2014

Location: Rouen, France

Technical Chair:

Prof. Bruno Allard, INSA de Lyon
Dr. Olivier Latry, GPM University of Normandy
Dipl.-Phys. Thomas Harder, ECPE e.V.

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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