Coordinator: STMicroelectronics, Roberto Zafalon
Automotive Industry Institute PIMOT, BITRON, Brno University of Technology, Centro Ricerche Fiat, DEST, Institut mikroelektronickych aplikaci, Institute of information theory and automation, ISD, Micron Semiconductors, Polimodel, Polytechnic University of Turin, Puremobility, Sapienza University of Rome, SINTEF, STMicroelectronics, University of Perugia, Warsaw University of Technology
(Czech Republic, Greece, Italy, Norway, Poland)
In both conventional and electric vehicles, power supply reliability is a major challenge. Electronic packaging has a substantial impact not only on overall complexity and efficiency but also on safety in the event of a crash and/or fire. The main objective of the ENIAC JU project IDEAS is, therefore, to develop advanced packaging for power supply components and new generation memory systems for applications in electric and/or internal combustion engined vehicles. The project also covers aspects that have not been addressed in other ENIAC and ARTEMIS automotive electronics projects.