Semiconductor Packaging University Program

The Fifth Edition of the CITC Semiconductor Packaging Course starting soon!

Semiconductor Packaging University Program for Industry Participants

The program provides a connection between education and industry and as such contributes to the training and skills of people that align with industry needs. People who are in high demand – now and in the future. The program therefore represents an important step in securing the future of the semiconductor industry in Europe.

CITC Brochure

CITC Website


Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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