European Projects, ECSEL
Date: 01/07/2015 - 01/07/2018
10 partners from 4 nations
7,6 Mio. €
Smart Power BCD technology is the combination of Bipolar, CMOS and DMOS devices on the same IC. This technology has been a market winner during the last decade as BCD includes a large set of product’s families shaped in different voltage/current range allowing to serve a variety of application domains, from high voltage industrial application, to high current in automotive and peripherals, motor drivers, LED drivers for luminaires, and power drivers for MEMS.
Actually, the tough market competition combined with a significant pressure on price (thus margin erosion) are setting the stage for the next technology wave, which will require huge strategic investments to push forward both the technology and the manufacturing facilities. In short, we need to make the technology and the manufacturing fab ready to move from 200mm to 300mm wafer size.
The transition to 300mm will shape up for Power Discrete devices as well, i.e. IGBT and power MOSFET, whose rising volume’s demand and large device’s area are even more demanding.
The goals of this project are:
Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
D-90443 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0
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