With the successful introduction of electrified vehicles on the market, the upcoming challenge is to achieve affordability, user friendliness and optimization of the infrastructure. In parallel to the ongoing developments of vehicles powertrains, electronics and sub-systems innovations will enable new functionalities in EVs. On the infrastructure side, variable and higher charging power are coexisting and connected services are currently under development. New developments in the electronic architecture as well as in the system integration of innovative sub-systems in the vehicles are required to leverage the benefits of new functionalities for the user. The topic should contribute to face the challenge of the development of new components, systems and architectures required for the next generation of electrified vehicles that will allow to meet end-users expectations in terms of cost, convenience of long range travel and comfort, by finding for each application the best compromise between fast charge, battery size and battery life.
Proposals will have to address one or more of the following technical areas:
- Integrated electric/electronic architectures (incl. high voltage) and control systems for third generation electrified vehicles powertrains.
- Development of smart bus systems, electric motors, power electronics enabling smaller form factors, when integrated in batteries and motors and modular approaches, connectivity and systems for enabling automated driving functions, have to be considered.
- Modular and flexible on-board charging optimized for infrastructure capabilities taking into account variable power with up to 350 kW
- Breakthrough heating and cooling concepts to minimize the impact on vehicle range in extreme conditions.
- For each of technical areas reliability, safety and security to be considered – including for instance electromagnetic compatibility and sensorisation of components. Coverage of research on all quality aspects is required to keep quality high and costs due to failures low using components and sub-systems for the 3rd generation. Research topics are like modelling of aging, lifetime, bonding, packaging, cooling, manufacturing in general, traceability and a database for failure mechanisms.