Call for Papers: Special Issue on Reliability of new Technologies for PE

Deadline for Submission of Manuscript: November 30, 2019

Aims and scope
According to Eurostat, renewable energy share in the EU was 17.5% in 2017. The current growth in the global share of energy generation and consumption that is electrically based is predicted to accelerate over the coming decades, reaching 70% in 2050 . Both these amazing results rely completely on power electronics that is needed to convert voltages and frequencies to match the specific application, such as industrial drives, automotive, aerospace and railway transportation. Therefore, power electronics technology is demanded to be more and more reliable to cope with such an impressive trend.
Frontier Silicon-based technologies, such as 3-D integration and smart power devices, wide bandgap semiconductors (WBG), new packaging interconnections, emerging passive technologies, and new concepts, such as disruptive conversion topologies, are capturing increasing interest, even though their reliability performance is still far to be demonstrated. It is generally recognized that electronic equipment is stressed by many factors, including extreme mission profiles, temperature, humidity, vibration, cosmic rays, which lead to the degradation of the components, therefore multidisciplinary knowledge is needed, as illustrated by the triangle in the figure.
Prospective authors are invited to submit original contributions or overview papers for review for publication in this special issue. Topics of interest include, but are not limited to:

  • Failure mechanisms in modern power semiconductor devices
  • Reliability of advanced interconnections and layout concepts
  • Packaging-level reliability
  • Reliability of passive components
  • Robustness design – design for reliability in present and future power electronics
  • Testing for reliability – accelerated tests
  • Mission-profile modeling and simulation in power systems
  • Optimization for reliability in modern power electronics
  • Design of modular/fault tolerant power electronic systems for reliability
  • Reliability assessment of disruptive conversion topologies
  • Thermal management
  • Prognostic methods in power electronics
  • WBG Materials – physics and technological issues
  • WBG device lifetime modelling and prediction
  • Comparison on robustness and reliability performance between Silicon and WBG
  • Radiation



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