In field service, very long conduction pulses occur e.g. in the “hill hold” of EVs or during the synchronous operation of DFIGs of wind turbines. Although this is well within the specifications of the respective semiconductor devices, the effects going on like increased creep in joints, bipolar degradation in SiC, intermetallics formation or even the occurrence of instabilities are rarely investigated, not to mention tested during qualification. The study aims to support the inevitable discussion regarding the introduction of a High Temperature Forward Bias (HTFB) test into the relevant qualification standards.
The Study is available for ECPE Members in the Members Area.