Call for papers

Scheduled Publication Time: February 2021

Papers that demonstrate the potential of wide-bandgap technology for power applications, address technology bottlenecks
and demonstrate potential breakthroughs are particularly welcome. Topics of interest include, but are not limited to:

Materials and Devices (Current state-of-the-art and forecasting)

•  SiC Power Devices
• GaN Power Devices (HEMTs, integration, and vertical GaN)
• Ultra-WBG materials

Packaging and integration, including materials, processes, architectures and tools:

• Packaging and integration for high speed switching
• Higher voltage (>10 kV) packaging
• Packaging for operation at higher temperatures and in other harsh environments

System Integration and Application of SiC and GaN

• Novel applications and converter topologies enabled by GaN and SiC
• Design and Simulation methods for GaN and SiC-based system designs
• Converter design, control, and protection
• Passives, cooling and integration for WBG converters