Scheduled Publication Time: February 2021
Papers that demonstrate the potential of wide-bandgap technology for power applications, address technology bottlenecks
and demonstrate potential breakthroughs are particularly welcome. Topics of interest include, but are not limited to:
Materials and Devices (Current state-of-the-art and forecasting)
Packaging and integration, including materials, processes, architectures and tools:
System Integration and Application of SiC and GaN
Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Landgrabenstrasse 94
D-90443 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0
© 2018 ECPE European Center for Power Electronics e.V.