System integration of power electronics systems yields to many improvements, like electrical performance, reduced size and weight and finally less cost. Thermal manage-ment is, however, becomes more complex and calls for increasing attention.

The first day deals with Thermal Interface Materials (TIM):
As there are many different TIMs in use, the workshop will start with a classification of materials, properties, and applications. Case Studies will show the potential of different TIM materials. Next TIM reliability will be discussed from the testing and characterization point of view under consideration of the physics of failure.

The second day starts with thermal management of advanced substrates, like embedded power boards and substrates with channels for liquid cooling. Case studies describing double-side cooling and two-phase cooling demonstrate the maximum cooling capability.

Finally thermal management solutions for power electronics systems will be discussed.

Chairmen:
Prof. Eckhard Wolfgang (ECPE e.V.)
David L. Saums (DS&A LLC)
Dr. Olaf Wittler (Fraunhofer IZM)

All presentations and discussions will be in English language.