Workshop

Materials Innovations for Advanced Power Packaging – Substrate, Interconnection and Encapsulation | ECPE Hybrid Workshop

Date: 09/10/2024 - 10/10/2024

Location: Frankfurt, Germany

Technical Chair:

Karl-Friedrich Becker, Fraunhofer IZM (DE)
Shiori Idaka Mitsubishi, Electric Europe (DE)


Technical Contact:

Gudrun Feix ECPE e.V.
+49 911 81 02 88 – 15
gudrun.feix@ecpe.org


Registration Deadline: 02 October 2024

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Materials Innovations for Advanced Power Packaging – Substrate, Interconnection and Encapsulation | ECPE Hybrid Workshop

Power electronics packaging is a dynamic and multidisciplinary field. On the one side it enables full performance of power semiconductors, and on the other side it determines the performance of a power converter. Power semiconductors with a wide bandgap become commercialized more and more. They offer not only a higher breakdown voltage, but also higher operating temperature and faster switching. Packaging concepts and materials need to be adapted to these needs. Processability for new packaging concepts, low dielectric losses or high breakdown voltage are only some characteristics, materials for power packaging must provide. In this ECPE workshop, we will have a look at new developments and trends in materials needed for building power electronic discretes, modules and converters. We will cover trends in interconnection technologies for chips and large areas, we will discuss developments in potting and encapsulation, and take a look at new substrates as basis for many modules. Embedding power electronic semiconductors or passives into PCBs finds its way into commercial products step by step, so we will as well look at ongoing activities in this field, especially the development of FR4 and other PCB materials especially suited for power electronics with its need for high temperaturestability and low CTE. Material characterization and inspection methods will be introduced. An overview over existing and upcoming EU regulations on materials will complete the programme.

Workshop

Materials Innovations for Advanced Power Packaging – Substrate, Interconnection and Encapsulation | ECPE Hybrid Workshop

Date: 09/10/2024 - 10/10/2024

Location: Frankfurt, Germany

Technical Chair:

Karl-Friedrich Becker, Fraunhofer IZM (DE)
Shiori Idaka Mitsubishi, Electric Europe (DE)


Technical Contact:

Gudrun Feix ECPE e.V.
+49 911 81 02 88 – 15
gudrun.feix@ecpe.org


Registration Deadline: 02 October 2024

Hybrid Event | ECPE Workshop: Materials Innovations for Advanced Power Packaging – Substrate, Interconnection and Encapsulation

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Industry: ECPE Member Companies: 3 seats free of charge (confirmed by ECPE staff in sequence of allocation)

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Register before 2 October 2024

  • The on site participation fee includes dinner, lunches, coffee/soft drinks and digital proceedings.
  • The online participation includes remote access via the meeting software Webex and digital proceedings.
  • Digital proceedings will be provided by download link latest one day before start of the event. A printed version of the workshop handout is available on request.
  • Upon receipt of registration confirmation via email you are signed-up for the event. The invoice will be sent via email.
  • Online participation by web conference tool (Webex). Access data will be provided by email.
  • Further information (hotel list and maps) will be provided after registration and can be found on the ECPE web page.
  • Payment by credit card not possible.
  • Cancellation policy: Full amount will be refunded in case of cancellation up to 2 weeks prior to the event. After this date 50 % of the fee is non-refundable (substitutes are accepted anytime).
  • If the event cannot take place because of force majeure or for good cause, a change to an online format or a cancellation is possible. The delegates shall be informed immediately. In this case, the participant is able to cancel free of charge. No claims beyond this shall be entertained.
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Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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