Tutorial

ECPE Tutorial: Thermal Engineering of Power Electronic Systems Part I: Thermal Design and Verification

Date: 15/06/2021 - 16/06/2021

Location: Nuremberg, Germany

Technical Chair:

Dr. Thomas Heckel, Fraunhofer IISB
Nils Jahn, TU Dortmund University
Prof. Martin Pfost, TU Dortmund University
Prof. Uwe Scheuermann, Semikron Elektronik
Zoltan Sarkany, Mentor Graphics
David Sulyok, Siemens Industry Software
Dr. Arendt Wintrich, Semikron Elektronik


ECPE Contact:
Ingrid Bollens 
+49 911 81 02 88 - 10
ingrid.bollens(at)ecpe.org

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ECPE Tutorial: Thermal Engineering of Power Electronic Systems Part I: Thermal Design and Verification

Registration Deadline: 8 June 2021


Thermal engineering of power electronic systems is a key to achieve high performance and reliability. The focus of the tutorial is the thermal design and validation of a power electronic inverter exemplified by a 100 kW SEMIKUBE IGBT converter equipped with additional thermal sensors. The attendees should have basic knowledge on power semiconductor devices and power electronics systems.

Part 1: After a review of the basic theory of heat transfer, the calculation of losses in a voltage source inverter will be explained. For selected stationary operating conditions, the expected device temperatures of the sample converter will be calculated from datasheet values. Application of online tools to facilitate this process will be demonstrated. Participants can chose between FEM simulations and equivalent thermal network calculation with LTspice™ to simulate these operating conditions. The results are compared to thermal measurements using thermocouples and an IR camera. Furthermore, a 3rd practical training group will deal with modeling of a power board with 3D CFD thermal analysis.

Part 2: Following a brief summary of the results of the first part, failure mechanisms, both at semiconductor and package levels will be introduced. After that, thermo- /damage-sensitive parameters will be discussed, together with theoretical background of thermal impedance measurement. A practical experiment about measurement of thermal impedance with standard laboratory equipment will end the first day. The second day will start from concrete design for reliability concepts, then aim straight at lifetime estimation, based on both power cycling and mission-profile approaches. Advanced electro-thermal and thermo-mechanical simulation will follow, and an overview about cooling systems will conclude the 2-day tutorial.

All presentations and discussions will be in English.

Tutorial

ECPE Tutorial: Thermal Engineering of Power Electronic Systems Part I: Thermal Design and Verification

Date: 15/06/2021 - 16/06/2021

Location: Nuremberg, Germany

Technical Chair:

Dr. Thomas Heckel, Fraunhofer IISB
Nils Jahn, TU Dortmund University
Prof. Martin Pfost, TU Dortmund University
Prof. Uwe Scheuermann, Semikron Elektronik
Zoltan Sarkany, Mentor Graphics
David Sulyok, Siemens Industry Software
Dr. Arendt Wintrich, Semikron Elektronik


ECPE Contact:
Ingrid Bollens 
+49 911 81 02 88 - 10
ingrid.bollens(at)ecpe.org

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Landgrabenstrasse 94
D-90443 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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