Workshop

ECPE Workshop: Advanced Power Packaging - Power Modules 2.0

Date: 09/10/2019 - 10/10/2019

Location: Hamburg, Germany

Technical Chair:

Prof. Cyril Buttay Université de Lyon, Laboratoire Ampère (France)
Prof. Frank Osterwald, Danfoss (Germany)
Dr. Andreas Ostmann, Fraunhofer IZM (Germany)

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ECPE Workshop: Advanced Power Packaging - Power Modules 2.0

In power electronics packaging, a lot of new developments are taking place. Wide bandgap devices with their possibilities for fast switching and higher temperatures, or more robust and reliable power electronics systems for transport and renewables push the limits. That means that new materials need to be developed, new cooling technologies are investigated, functional integration of peripheral devices into so called power electronics building blocks is used for reducing parasitics, 3D-printing and additive manufacturing offer possibilities to think power electronics in a totally different way.
This workshop presents new developments and ongoing research from industry and universities. System developers, packaging and material specialists, researchers and engineers from industry companies may use this workshop to get new ideas for their daily work.

Proceedings

General information

Workshop

ECPE Workshop: Advanced Power Packaging - Power Modules 2.0

Date: 09/10/2019 - 10/10/2019

Location: Hamburg, Germany

Technical Chair:

Prof. Cyril Buttay Université de Lyon, Laboratoire Ampère (France)
Prof. Frank Osterwald, Danfoss (Germany)
Dr. Andreas Ostmann, Fraunhofer IZM (Germany)

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Landgrabenstrasse 94
D-90443 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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