Further Power Electronics Events
Date: 28/05/2023 - 01/06/2023
Location: Hongkong, Hong Kong SAR of China
Deadlines:
Extended abstract submission: December 19, 2022
Author notification: February 6, 2023
Late news submission (limited acceptance): March 10, 2023
Final manuscript submission deadline: March 24, 2023
The IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) is the premier forum for technical discussions in all areas of power semiconductor devices and power integrated circuits. Topics include, but not limited to, High Voltage Power Devices, Low Voltage Power Devices and Power IC Technology, Power IC Design, GaN and Compound Materials, SiC and Other Materials and Module and Packaging Technologies.
Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Landgrabenstrasse 94
D-90443 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0
© 2018 ECPE European Center for Power Electronics e.V.