ECPE co-sponsored Conferences
Date: 02/03/2026 - 05/03/2026
Location: Phoenix, AZ, United States
The 22nd Annual Device Packaging Conference (DPC 2026) will be held in Phoenix, Arizona, on March 2-5, 2026. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
The 2026 conference will feature 4 keynote presentations, an embedded Global Business Council Plenary Session, an interactive poster session, an evening panel discussion, and more.
Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0
© 2018 ECPE European Center for Power Electronics e.V.
