iMAPS Thermal Management Workshop

This yearly conference takes place since 2006 and gathers between no less that 80 and up to 110 thermal specialists coming from all over the world. A good opportunity for developing its own professional network and identify Who’s Who in electronics packaging and thermal management. The workshop sessions will include the following topics: 

• Cooling solutions for microelectronics packaging
• Micro-cooling solutions
• Heat conductive materials at chip, board, sub-system and system levels
• Advances in PCBs for thermal management
• Thermal modeling and simulation
• Heatsinks, heatpipes and other cooling products
• Liquid and phase change cooling
• New cooling solutions
• Overviews or examples of products, systems cooling, power electronics, automotive transport, …
• Thermal management of optoelectronics components (LEDs, IR sensors…)
• Reliability of electronic components over extended temperature range and under temperature variation..
• Thermal management aspects of 3D integration: thermal interface materials, dissipation from PCB embedded components and hot spots, and special techniques (e.g. micro-channels)

iMAPS Website