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Hesse GmbH – Your partner for ultrasonic
and thermosonic wire bonders for all
common wire dimensions as well as ultra-
sonic flipchip bonders in combination with
standardized or customized automation
solutions.
Hesse GmbH, founded in 1986 and based
in Paderborn, Germany, develops and
manufactures fully automatic ultrasonic
and thermosonic wire bonders as well as
ultrasonic flipchip bonders together with
standard or customer-specific automation
solutions for the semiconductor industry
backend. Hesse GmbH is one of the
world’s leading producers of wire bonders
using the ultrasonic wedge-wedge and
the thermosonic ball-wedge technology
and develops customer-specific produc-
tion processes.
All relevant semiconductor manufactur-
ers are among the worldwide clientele of
Hesse GmbH. Distribution and service are
performed from the headquarters or by
subsidiaries in Hong Kong, the USA and
Japan and together with partners in over
30 other countries.
The core competencies of the company
are mechatronic systems, ultrasonic tech-
nology, control engineering and the de-
tailed understanding and knowledge of
the processes and physical effects rele-
vant in ultrasonic joining technology.
In order to maintain and expand techno-
logical leadership, we conduct intensive
research and development in all afore-
mentioned areas.
Development goals include simple and
wear-free constructions with highly inte-
grated functionality and the integration
of intelligent systems for achieving fault-
free processes like the patented process
integrated quality control (PiQC) which
records and evaluates quality-relevant pa-
rameters in real time.
Process support, development and con-
sulting:
We support our customers in developing
and implementing individual process re-
quirements. Our range of services includes:
•
Sample-bonding
•
Pre-production prototype
•
Design validation builds
•
Small series production
•
Module production
•
Process optimization
Copper ribbon bonding in detail
Bondjet BJ935 – Fully Automatic Heavy Wire Bonder
HESSE GmbH
