The ECPE Network - page 45

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fully automated transient thermal resist-
ance and cycling at the same time, on
the same machine, without having to
remove the device under test during the
process. The Power Tester 1800A and
3600A sense current, voltage, and die
temperature while using structure func-
tion analysis to record changes or failures
in the package structure. While running
power cycles, the real-time structure func-
tion analysis shows the failure in progress,
the number of cycles, and the cause of
the failure, eliminating the need for a lab
post-mortem. The testing and characteri-
zation data produced by the Power Tester
series can be used to calibrate and validate
detailed models in FloTHERM and FloEFD
thermal simulation software.
Test a Wide Range of Power Electronics:
Includes metal-oxide semiconductor field-
effect transistors (MOSFETs), insulated-
gate bipolar transistors (IGBTs), and power
diodes.
Conduct Continuous Power Cycling un-
til Failure: Component can be left on the
tester.
User-Friendly Touch-Screen Interface:
Records a broad range of information
during test including detailed structure
function analysis to record changes in
the package’s thermal structure.
Apply Different Powering Strategies dur-
ing Operation: Constant power on/off
time, with constant case temperature
swing, constant junction temperature
rise, or constant applied power.
Mentor Graphics
Mentor Graphics offers many
products but all with the same aim:
to enable companies to develop better
electronic products faster and more cost-
effectively. This extends to the MicReD
product range, specialising in Thermal
Characterization and Testing of electronic
components from LEDs to IGBTs.
Mentor Graphics offers the T3Ster
®
:
enabling thermal characterization of semi-
conductor device packages including
digital ICs, stacked dies, and MCMs,
and power electronics devices, including
MOSFETs and IGBTs which can be test-
ed at high power. Together with T3Ster,
TeraLED
®
enables the full thermal, photo-
metric and radiometric characterization
of power and HBLEDs. The DynTIM
®
, pro-
vides a cutting-edge solution for measur-
ing thermal performance of thermal inter-
face materials (TIMs). With DynTIM
®
the
thermal conductivity of greases, pastes,
phase-change materials, adhesives and
solid samples can be measured with high
accuracy.
REAL-TIME FAILURE DIAGNOSIS:
MicReD Power Tester 1800A and 3600A
are the only machines built for manufac-
turing as well as laboratory environments
that do automated power cycling while
producing analytical data for real-time
failure-in-progress diagnosis. They are
designed to perform lifetime testing to
test the reliability of applications that use
power electronic modules. The Power
Tester series is unique in that it provides
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