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F & K DELVOTEC Bondtechnik GmbH, the
innovation leader in wire bonding, was
founded in 1978 and has since then pio-
neered the development of new technolo-
gies that have subsequently progressed to
become market standards. Until now
F & K DELVOTEC won over 40 patents
worldwide, and successfully delivered over
6.000 wire bonding machines to major
accounts within the semiconductor, elec-
tronics and automotive industries.
As specialists for assembly and joining
technologies we have been committed to
continuing to develop reliable and effi-
cient solutions for connecting electronic
components.
In the field of wire bonding for customers
in the semiconductor, E-Mobility, Photo-
Voltaic and automotive industries, F & K
DELVOTEC develops complete solutions
for partial or full automation. The all-round
service ranges from applications guidance
in the selection and configuration of the
wire bonding machines to attached buffer
stations and magazine lifts all the way to
the integration of handling systems for
complex production lines. The standard
portfolio covers bonding equipment in
fine, ball/wedge and heavy bonding tech-
nology.
The boom in the market for power elec-
tronics continues unabated. Because of
the physical limits to the current carrying
capacity of wire bonded connections,
F & K DELVOTEC developed a robust and
extremely reliable technology for joining
aluminum and copper ribbons on DCB
and other substrates: laser bonding.
Already at the product development stage,
F & K DELVOTEC is ready to help with pre-
trials to evaluate the bondability of mate-
rial surfaces, and with product design.
This is of great value in Design for Manu-
facturability, shortens the development
time and optimizes the process of adding
value from the start.
Only the best trained personnel can ex-
tract the best from bonding technology.
That’s why we support our customers
during the complete lifetime of any F & K
DELVOTEC wire bonder with a range of
services in our Bond Academy. These run
from applications advice through support
during the product development to train-
ing classes regarding wire bonding in gen-
eral and the machine operation. F & K
DELVOTEC offers applications support,
sample bonding, bond quality measure-
ments and training throughout the life-
time of the wire bonders.
With our bonding experts the semicon-
ductor industry, the automotive industry
and other highly innovative electronic
branches are in safe hands.
F & K Delvotec Bondtechnik GmbH
Heavy Wire bonding – detailed view
Ultrasonic Heavy Wire Bonder M17
