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General Information
The University of Applied Sciences in Kiel
is the largest Applied Science Institution
in the State of Schleswig Holstein. In 2011
more than 6000 students were enrolled
with more than 1000 students in the Fac-
ulty of Computer Science and Electrical
Engineering. The Institute for Mechatron-
ics as a part of the faculty is offering ed-
ucation and research participation for
about 150 Bachelor and Master Students.
The Key Aspect is E-Mobility
The Institute for Mechatronics has a
strong focus on E-Mobility and its hard-
ware components which led to the es-
tablishment of the Schleswig Holstein
Competence Centre for E-Mobility
(
). In research pro-
jects e.g. the daily use of electric vehicles
(Peugeot Ion, EcoCarrier) is analyzed and
a new battery management system is de-
veloped. 5 Professors in the Institute are
offering specialized educational contents
like electrical traction and drives, electri-
cal circuit design, technical optics, me-
chanical design, system modeling and
control techniques.
The Bonding and Joining Lab
Professor Ronald Eisele is part of the E-
Mobility-Team and his courses and re-
search capabilities in the labs are consist-
ing of:
•
Thermal modeling, simulation and de-
sign of systems and components
•
Electrical and thermal design of power-
modules
•
Professional assembly processes for
bonding joining tasks
•
Testing and characterizing of power
electronic components
These capabilities are also offered for in-
dustrial development demands e.g. in
bilateral projects. By participating in re-
gional and nationwide research projects
these capabilities are constantly further
developed.
The scientific team includes experienced
engineers, Ph.D. Students (coopera-
tive graduations with other universities),
Bachelor and Master Students working
on their theses.
The team is designing and manufactur-
ing powermodule samples in industry-like
quality by applying:
•
Process-Development for Low-Temper-
ature Sintering of power semiconduc-
tors and passive components, termi-
nals, buffers and heatsinks
•
Multiple design approaches based on
different substrates (DBC, IMS, Lead-
frame)
•
Final encapsulation in frames or hard
epoxies
In the bonding and joining labs the team
is running a number of specially modified
equipment in order to support the indus-
trial partners in applying low temperature
sintering. A very promising new invest-
ment and research target is the combina-
tion of sintering and Cu-heavy wire bond-
ing (Orthodyne 3600+ new Cu-Version).
University of Applied Sciences Kiel
Sintered die attach on Leadframe
Bonding and Joining Technologies
CAD Power Module Development
