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Research from miniaturized electronic
devices to complex mechatronic
systems
FAPS concentrates its research activities
on innovative manufacturing technologies
at all levels of mechatronics, from a min-
iaturized device to a complex system. For
that purpose FAPS employs more than 90
dedicated researchers and technicians.
The Institute operates two laboratories
on an area of 2500 sqm with most mod-
ern facility equipment to ensure highly in-
novative developments in mechatronics
manufacturing.
A key research field of the institute FAPS
is packaging of electronic components
and the assembly of electronic devices:
•
simulation-based manufacturing and
analytical processes,
•
structuring and metallization of 2D and
3D circuitry by laser direct structuring,
selective laser sintering, aerosol jetting,
and plasma-based coating systems,
•
stencil printing and dispensing of sol-
der and sinter paste as well as conduc-
tive adhesives,
•
highly accurate component placement,
•
high pressure convection and vacuum
vapor phase soldering,
•
thin wire and thick wire bonding,
•
Innovative production line concepts
with reactive multilayer materials
•
SPI and AOI,
•
optical, mechanical, thermal and elec-
trical quality insurance
•
reliability tests and lifetime modeling.
These core competences in electronics
production are used for the development
of miniaturized PCBs, multi-functional
mechatronic integrated 3D-devices and
high performance connectivity and inte-
gration technologies for power electron-
ics. The qualification of mechatronic
devices is performed by test systems for
climatic, temperature, corrosive, vibra-
tional and electric loads. A well-equipped
metallography and inspection equipment
like X-Ray including CT or confocal laser
scanning microscopy can be used for fail-
ure detection. Capable software systems
enable computer based development and
simulation of products, processes and
production facilities.
Additional to the field of electronic pro-
duction FAPS researches in the area of
bio-mechatronics, systems engineering
and electric drives technologies. A key
project is the E|Drive-Center where man-
ufacturing technologies for electric drives
like winding, magnet assembly and metal
sheet packaging and the enhancement
of interconnection technologies between
electric drives and power electronics are
developed.
FAPS creates and realizes innovation
through the integration of knowledge
from different fields, in particular
•
disciplines of mechanics, electronics,
information technology, bionics and
optics,
•
integration levels from the component
to the system,
•
the entire product life cycle, from con-
cept, via development, production,
use, through to recycling,
•
by university research and teaching,
industrial cooperation and spin-offs,
•
through sustainable and efficient
methods for the production, distribu-
tion, use, storage and reuse of resources.
FRIEDRICH-ALEXANDER-UNIVERSITÄT ERLANGEN-NÜRNBERG,
LEHRSTUHL FÜR FERTIGUNGSAUTOMATISIERUNG UND PRODUKTIONSSYSTEMATIK (FAPS)
Conductive adhesives and copper wire bonding
enable new interconnection technologies for power
electronic applications
Innovative production line concepts based on new packaging technologies such as reactive multilayer materials
