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Boschman Technologies is the world’s
leading supplier of automatic molding
systems using Film Assisted Molding
(FAM) technology and the experience
built up with the molding technology
Boschman Technologies also uses for the
Ag Silver Sintering Presses for power
packages to replace soldering.
Boschman Technologies develops new
processes for the Ag-sinter technology
under pressure and the encapsulation of
power packages. Boschman Technologies
delivers the encapsulation equipment
and sintering presses to the worldwide
semiconductor and electronic industry.
Boschman Technologies provides in a
close cooperation with the semi-industry
new processes and equipment for the
Power packages.
The “basic“ technology of molding with a
protecting film started more than 15 years
ago and the semiconductor industry looks
with favour on the advanced processes of
encapsulation. Boschman Technologies
has the technology to (partly) encapsulate
the Power packages in such a way that
the “heatsink” area of the package can
perform its function in a perfect encapsu-
lated environment. .
Transfer molding is the
primary process method
for the microelectronic
encapsulation and with
encapsulation material-
epoxy molding com-
pound (EMC), one of the
first applications was the
transistor package. Tra-
ditional transfer molding
process has disadvantag-
es including EMC bleed
and resin flash, time con-
suming mold cleaning,
mold wearing, package deformation dur-
ing the ejection process and lead frame
deformation or (ceramic) substrate crack-
ing due to clamping. FAM deals with chal-
lenges of releasing components from the
mold and keeping certain surfaces -heat-
sink- clean from molding compound.
Releasing from the mold and product
surfaces is accomplished by a “seal film”
and the seal film is refreshed after every
molding cycle. The seal film is functioning
as a gasket, reducing the clamping force,
and allowing clamp and seal on dies and
ceramic surfaces.
In close cooperation with the Ag sinter
material suppliers Boschman developed
a family of Ag sinter presses from Semi
automatic up to complete automatic
systems for high volume production.
The Dynamic Insert Technology, devel-
oped for the molding presses, Boschman
Technologies is also using for the Sintering
Systems.
Sintering in the Boschman presses is for lead
frames, substrates or ceramic carriers and
the film protects the die surfaces against
damages. With the Dynamic Insert Tech-
nology the clamping on the dies and DBC’s
is done with a very precise force control
compensating for built up tolerances.
The Boschman Systems are designed for
low cost, fast and easy product conversion.
Boschman Technologies
molded part
