14
Unique market position
AT&S is the European market leader and
one of the globally leading manufacturers
of high-value printed circuit boards. AT&S
industrialises leading-edge technologies
for its core business segments Mobile De-
vices (Smartphones, Tablets, Ultrabooks,
Consumer Electronics), Automotive (high-
end applications like advanced driver as-
sistance systems – lane change assistant,
navigation – or safety features, gearbox,
etc.), Industrial (machine to machine com-
munication, power solutions,..), Medical
(diagnosis like MRT or therapy applications
like hearing aids, pacemakers, etc.) and
Advanced Packaging (Chip embedding).
Global Presence / Customer and
supply chain proximity
AT&S has a global presence, with pro-
duction facilities in Austria (Leoben and
Fehring) and plants in India (Nanjangud),
China (Shanghai, Chongqing under con-
struction) and Korea (Ansan, near Seoul).
The company currently employs about
8,600 people.
Clear focus on high-end
connecting solutions and
applications
Depending on technologi-
cal requirements, AT&S of-
fers an extensive techno-
logical range of printed
circuit boards specially tai-
lored to customers’ needs:
from double-sided plated-
through, multi-layer, HDI
(high density interconnection, laser-drilled)
or HDI Anylayer, IMS (insulated metallic
substrate), flexible, rigid-flex and semi-
flexible. Miniaturisation and modularisa-
tion are the key drivers in the electronic
industry. Starting in 2016, AT&S will po-
sition itself in the high-end market at
the new site in Chongqing (China) with
two new leading-edge technologies:
IC substrates for
high-performing
computing appli-
cations and sub-
strate-like print-
ed circuit boards
– the basis for SiP
(System-in-Pack-
age) technology.
Advanced packaging – important
part of the future growth for AT&S
AT&S is the leading provider for Embed-
ded Component Packaging Solutions. Its
patented ECP
®
technology enables fur-
ther miniaturisation while improving per-
formance.
Power a further focus for embedding
technology
Together with the EmPower consortium
AT&S announced the stage of industriali-
sation for embedded power packages for
Industrial and Automotive applications.
This solution provides a significant in-
crease in efficiency and performance and
miniaturisation levels up to 50% for pow-
er modules compared to existing packag-
ing solutions. New plating equipment for
wafer level plating has been developed in
order to realise double sided copper plat-
ed power dies. This enables a new supply
chain for embedded power devices and
new packaging solutions for applications
in the power ranges from 50W to 50kW.
Further information for EmPower
Austria Technologie & Systemtechnik Aktiengesellschaft
High end Production in Leoben
Embedding technology for volume production
2 KW Power converter
with embedded GaN
semiconductors
