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Alpha Assembly Solutions, Inc.
Products. Partnership
Alpha Assembly Solutions, a MacDermid
Performance Solutions Business, is the
global leader in the development, man-
ufacturing and sales of innovative elec-
tronics assembly materials such as Solder
Pastes, Exactalloy
®
Solder Preforms, Cored
Solder Wire, Wave Soldering Fluxes, Bar
Solder Alloys and Stencils.
With a global presence in over 30 locations
throughout the Asia Pacific, Americas and
Europe regions and the largest R&D man-
ufacturing capacity in the industry, Alpha
is able to bring customised and proactive
solutions directly to electronics manufac-
turers in a wide range of industry seg-
ments, including power electronics, die
attach, LED lighting, semiconductor pack-
aging and automotive electronics.
Powering Solutions
In response to the power semiconductor
market’s drive to improve reliability and
device performance for automotive, alter-
native energy, transportation, consumer
electronics, telecommunications, industrial
and LED applications, Alpha Assembly
Solutions has developed its Argomax
®
and Fortibond™ range of products.
ALPHA
®
Argomax
®
Sinter Technology
products were developed in response to
the industry‘s demand for increased die
attach reliability and cost effective high
volume manufacturing. The technology
uses a low pressure sintering die attach-
ment based on highly engineered parti-
cles, developed by Alpha’s expert team
of engineers. Argomax
®
creates extremely
high thermal and electrical conductivity
silver bonds with a high reliability and
flexible bondline thickness for even the
most challenging technologies.
The technology is available in paste, film
and Argomax
®
9000 preforms, a first
for the Power Semiconductor Industry,
and is suitable for a wide variety of
applications, including power modules,
power discretes, bipolar devices, cavity
packages and wafer level processing.
Alpha’s Fortibond™ technology was
specially designed for LED manufactur-
ers that require pressureless sintering in
their die attach process. The technology
is based on Alpha’s proprietary pressure-
less silver sintering technology consist-
ing of highly engineered silver particles
and provides high thermal and electrical
conductivity silver bonds, high reliabil-
ity and flexible yet controlled bond line
thickness.
