Sinter technology is coming more and more in the focus for high performance power electronic applications. Sintering is overcoming the limitations of common solder materials, which are further on well suited for many discrete and small module device applications. Sinter systems enable to perform at harsh ambient conditions seen from extended mission profiles for automotive and industrial applications. These mission profiles typically drive longer high-temperature operating life, higher temperature cycles and require faster switching. Also, due to the significantly lower thermal resistance, the power density can be increased. The main benefits of silver as well as copper sintering are:

• High thermo-mechanical stability
• Highest electrical conductivity
• High thermal conductivity

Metal sintering is a surface interdiffusion of adjacent atoms to create a solid interconnection joint out of a metal particle network. To control the densification and the joint strength of the sinter connection the primary process influencers are the temperature, the time, the pressure, the nature of the sintering atmosphere, and the microstructure of the sinter paste. Sintering is an emerging technology compared to well-established soldering. Thus, it needs a careful consideration of the entire process chain including paste printing and drying, chip placement, and the final sintering step. The sequence of the steps as well as the parametrization depends on the targeted paste, the finishes, and the size of the joining area. As for all processes, there is still the necessity for quality management. The Workshop presentations will start with evaluation of sinter pastes, go to testing of sinterability of the metal finishes and end up with the final control of the sinter joints. Beside the standard sinter technology there will be an outlook to futures potential alternatives.

All presentations and discussions will be in English language.