European Projects

FP7: Power SWIPE

Date: 01/10/2012 - 30/09/2015

Coordinator: Cian Ó Mathúna (Tyndall National Institute)

Partner:
Tyndall National Institute, Infineon Technologies AG, Infineon Technologies Austria AG, Centro de Electrónica Industrial IPDiA SA, Robert Bosch GmbH, Laboratoire Ampère (Université Claude Bernard)

(Germany, France, Spain, Austria, Ireland)

Abstract:
The PowerSwipe project addresses a key roadblock for PowerSoC by, for the first time, miniaturising and integrating state-of-the-art, high density trench capacitor substrate technology with novel thin film magnetics on silicon to deliver a multi-component LC (inductor-capacitor) interposer which will be combined, in a 3D heterogeneous stack, using eWLB technology, with the μController chip.

FP7: Power SWIPE

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Landgrabenstrasse 94
D-90443 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

Subscribe to the ECPE News

 

© 2018 ECPE European Center for Power Electronics e.V.