European Projects

FP7: Power SWIPE

Date: 01/10/2012 - 30/09/2015

Coordinator: Cian Ó Mathúna (Tyndall National Institute)

Tyndall National Institute, Infineon Technologies AG, Infineon Technologies Austria AG, Centro de Electrónica Industrial IPDiA SA, Robert Bosch GmbH, Laboratoire Ampère (Université Claude Bernard)

(Germany, France, Spain, Austria, Ireland)

The PowerSwipe project addresses a key roadblock for PowerSoC by, for the first time, miniaturising and integrating state-of-the-art, high density trench capacitor substrate technology with novel thin film magnetics on silicon to deliver a multi-component LC (inductor-capacitor) interposer which will be combined, in a 3D heterogeneous stack, using eWLB technology, with the μController chip.

FP7: Power SWIPE

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Landgrabenstrasse 94
D-90443 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

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