Workshop
Date: 23/11/2022 - 24/11/2022
Location: Graz, Austria
Technical Chair:
Tina Thomas, Fraunhofer IZM (DE)
Dr. Chunlei Liu, Hitachi Energy Switzerland (CH)
ECPE Contact:
Marietta Di Dio
+49 911 81 02 88 - 13
marietta.didio@ecpe.org
Members Area
All proceedings since 2004, studies, reports and more... ECPE Network Members are welcome to register!
Login not necessary for event online-registration!
Registration Deadline: 15 November 2022
Power electronics packaging is a multidisciplinary field. On the one side it enables full performance of power semiconductors, and on the other side it determines the performance of a power converter. Chip embedding technologies mainly used in microelectronics industry have been also investigated for power electronics in recent years. Many advanced power semiconductor packaging and integration concepts have been studied and demonstrated. Some technologies are already adapted by the industry and applied in commercially available products.
The most widely spread technology here is embedding bare dies in FR4 materials and redistribute the contacts on the outer layers. But FR4 is not the only material which can be used, and semiconductors are not the only parts which can be embedded. In this workshop, we will also cast light on other materials, technologies, and components, based on molding and ceramics embedding.
As embedding and advanced integration technologies offer a lot of possibilities to manufacture power modules with a higher integration level than before at a reasonable price, more different materials are brought together than in conventional power electronics packaging. Simulation approaches to couple different steps in package development and taking into account the heterogenous materials are introduced in this workshop. Since power embedding has emerged from low voltage to higher voltage applications, the reliability topics will also be covered.
Workshop
Date: 23/11/2022 - 24/11/2022
Location: Graz, Austria
Technical Chair:
Tina Thomas, Fraunhofer IZM (DE)
Dr. Chunlei Liu, Hitachi Energy Switzerland (CH)
ECPE Contact:
Marietta Di Dio
+49 911 81 02 88 - 13
marietta.didio@ecpe.org
Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0
© 2018 ECPE European Center for Power Electronics e.V.