ECPE co-sponsored Conferences
Date: 21/06/2023 - 22/06/2023
Location: Amberg, Germany
Important Dates:
Submission of presentations May 12, 2023
MID Congress June 21 – 22, 2023
Technical Tour June 22, 2023
The International MID Congress is a scientific congress organised and held by the Research Association that deals with current topics on MID technologies. The event, which is held every two years in different cities and features scientific publications, is attended by around 200 people from industry and academia.
The Internet of Things (IoT) leads to an ongoing change of our life: Laptops, tablets and smart phones translate spoken texts simultaneously in any language, answer semantical questions and support our daily life. Cars drive autonomously, use current traffic intelligence to avoid congestions and warn others instantly in case of any danger. Every object in the future factories is able to exchange data, work pieces may choose discretely their optimal process route and machines report maintenance issues betimes. And last but not least wearable electronic accompany us in watches to control our vital functions, in shoes to detect our pace and in glasses to display essential information. All these kinds of innovative gimmicks applied in Cyber Physical Systems integrate sensory functions, electronic intelligence, energy storages, harvesting and communication capabilities in tightest installation spaces on freely formed surfaces and in light plastic housings. All of them use antennas, which have to be designed spatially to boost their emitting performance. More and more there will neither be enough space for flat circuit board, nor for other electromechanical parts. Mechatronics integration extends from the chip level as MEMS, through packaging, assemblies and products, to the system level. In doing so, mechatronics integrates all physical areas: mechanics, electrics, electronics, thermics, magnetics, optics, computer science. For this purpose, there are of course not only planar build-up technologies, but also always spatial solutions. Furthermore, for mechatronic functions have to be applied on any kind of materials e.g. ceramics, fabrics, foils, paper/carton, even skin, we have to develop our structuring, metallization or printing processes dynamically further.
Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0
© 2018 ECPE European Center for Power Electronics e.V.