ECPE Publications

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6th ECPE SiC & GaN User Forum ´Potential of Wide Bandgap Semiconductors
in Power Electronic Applications'

—Report of Conclusions—

Andreas Lindemann / OVGU

ECPE wide bandgap user forums have established as an international event where users | i.e., engineers developing advanced power electronic converters | and manufacturers of Silicon Carbide (SiC) and Gallium Nitride (GaN) devices meet biannually for a fruitful exchange. It recently was prepared in conjunction with a newly established ECPE SiC & GaN technical committee and hosted by University of Warwick (UK). The highest number of registrations ever showed the great interest of the community in this actual subject. Main technical focus has been on new developments with SiC and GaN transistors including system and circuit design or related aspects like packaging and parasitics. Renowned experts from all over the world have been invited to explain state of the art and trends, to foster physical understanding, to in depth explain their research and development work in technical presentations and to share their knowledge in discussions. The wide bandgap user forum this way has established a valuable platform to share experience and ideas, to show best practise of power electronic systems with of SiC or GaN, to discuss and nd out how to appropriately design-in those almost ideal but also challenging components, and which open issues need to be addressed. It aimed at pointing out approaches to exploit the high potential of those devices and to support their bene cial introduction in power electronic systems. Connected meetings of relevant research projects impressively complemented this aspect. The main topics of this year's ECPE wide bandgap user forum are summarised in the following



ESREF 2014 in Berlin

—Report of Conclusions—

Christian Boit / Berlin University of Technology

The 25th anniversary of the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) was held September 29 to October 2, 2014, in Berlin, Germany.


CIPS 2014 - A race towards the lowest inductive power module

—Report of Conclusions—

Eckhard Wolfgang / ECPE, Dieter Silber / Univ. Bremen

292 engineers and scientists attended the conference, 24% more than 2012.
Attendees came from 17 countries in Europe, America and Asia with 22 participants alone from Japan. The 8th International Conference on Integrated Power Electronics Systems (CIPS 2014) was held on 25-27 February 2014 in Nuremberg as part of the ECPE Annual Event. The Conference is organized by ETG, the Power Engineering Society within VDE, and by ECPE, the European Center of Power Electronics. IEEE PELS and ZVEI are technical co-sponsors.