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EDUCATION / TRAINING |
ECPE Seminar and Workshop Program |
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7/8 October 2008 |
ECPE - HOPE Symposium ´Automotive Power Electronics´ |
| | The automotive industry is a key driver for power electronics. This is due to the special boundary conditions and requirements in automotive appli¬cations like harsh and high temperature environments, high reliability, and cost pressure. The high production volumes on the other side justify the initiation of new technology steps.
The seminar covers automotive power electronics for high voltage drivetrain applications (hybrid traction, fuel cell and full electric vehicles) as well as for lower voltage applications like auxiliary drives for power steering, water or oil pumps, etc.
Results from the European HOPE research project will be presented which is funded by the European Commission in the 6th Framework Programme. In the 2nd part of the symposium, further research projects in Europe in the field of automotive power electronics will be presented.
Dr. Martin Maerz (Fraunhofer IISB) will chair the symposium together with Prof. Eckhard Wolfgang and Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of Seminar: Stuttgart-Sindelfingen, Germany |
Programme
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20 / 21 November 2008 |
ECPE Workshops ´Advanced Cooling Techniques/Power PCBs and Busbars´ |
| | 1st Workshop Day: Advanced Cooling
Thursday, 20 November 2008
9.00 – 17.00 h
Thermal management and reliability are, besides the costs, the most challenging issues in power elec¬tronics. Depending on the application, certain types of cooling are permitted which reach from natural convection to pool boiling as the most efficient cooling technique. The workshop will address the sources of heat generation in a power electronic system as well as the basics and possibilities of heat exchange. In the focus of the workshop are advanced cooling techniques, like two phase cooling and double-sided liquid cooling as well as new materials and heat pipes for heat conduction. Case studies will show typical applications for several industrial applications.
Prof. Dr. E. Wolfgang will chair the workshop together with Thomas Harder (ECPE). All presentations and discussions will be in English.
2nd Workshop Day: Power PCBs and Busbars
Friday, 21 November 2008
8.30 – 17.00 h
Printed circuit boards (PCBs) are traditionally associated with low power electronic circuits. In power electronics, PCBs are mostly used as the main carrier for low power converters. In the higher power range, PCBs are used as carriers for passives, driver and control circuits and interconnected to the power devices by means of busbars. An ongoing industry trend is to push the power capability of PCBs towards higher power, reaching 50kW or even 100 kW. From the system integration point of view, this is expected to bring cost benefits together with achieving more compact design and higher performance. The aim of this seminar is to explore the limits and boundaries of power PCB and bus bars for high power applications.
The seminar will cover various aspects of power PCBs, including evaluation of power PCB limits, thermal management considerations and techniques as well as novel enabling PCB and busbar technologies such as high current thick copper PCB technologies, miniature heat pipes for PCBs etc. Several case studies will show the use of power PCBs in power electronic converters. Furthermore, advanced integration PCB technologies such as EMPIC and Power Sandwich PCB technology will be presented.
A panel discussion will be organised where the experts will look at the state-of-the-art, future develop¬ments and applications of power PCBs.
Prof. Dr. J.A. Ferreira (Delft University of Techno¬logy) will chair the seminar together with Thomas Harder (ECPE). All presentations and discussions will be in held in English.
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| | Place of Workshops: Delft, The Netherlands |
Draft Programme
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4 / 5 December 2008 |
ECPE Tutorial ´Power Semiconductor Devices & Technologies' |
| | The tutorial starts with the presentation of relevant basic principles of modern power semiconductor devices:
Blocking capability of the devices, unipolar and bipolar current transport and gate control will be discussed. Diodes, MOS transistors (including Cool MOS) and IGBTs will be treated in detail including their dynamical properties, safe operation and temperature limits. As a consequence, the benefits expected from wide band gap semiconductors (SiC, GaN) will be discussed.
This introductory part is also the base for the next part devoted to power device models and the increasing role of virtual prototyping in power electronics.
The following chapters will demonstrate the state-of-the art and development lines of monolithic smart power devices and intelligent IGBT control circuits. Finally a short overview of hybrid power electronic integration and the most relevant aspects (cooling, reliability and EMC problems) will be presented.
This tutorial is aimed at engineers who are engaged in power electronics and want to improve their knowledge and understanding of power devices including the developments expected in near future.
The course instructor is Prof. Dieter Silber (University of Bremen), Co-instructors are Dr. Peter Tuerkes (Infineon Technologies, Munich) and Dr. Reinhard Herzer (Semikron, Nuremberg).
All presentations and discussions will be in English.
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| | Place of Tutorial: Nuremberg, Germany |
Programme
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2008 |
Seminar Programme 2008 |
| | Besides the Precompetitive Research and Public Relations for Power Electronics, Education & Advanced Training is the key mission of the ECPE Network. In 2007, we had a very successful programme of ECPE events with 650 participants.
Beside the ECPE Seminars and Workshops we started a new activity of ECPE Tutorials which are focussed more on the education of young engineers and career changers. Due to the positive feedback from the power electronics community we will extend the ECPE Tutorial Programme in 2008.
We are pleased to present to you the Seminar Programme 2008.
Again, we can offer up-to-date topics in power electronics, in cooperation with first class experts acting as Technical Chairmen.
Reliability of Power Electronic Systems – Tutorial (22 – 23 January 2008, Zurich, CH)
Digital Power Conversion – Seminar (February 2008, Munich, D)
Reliability of Power Electronic Systems – Tutorial (18 – 19 March 2008, Coventry, GB)
EMC in Power Electronics – Tutorial (8 – 9 April 2008 – Helsinki, FIN)
Towards Energy Gain and Savings - Emerging Drives and Generator Systems – Seminar (15 – 16 April 2008, Warsaw, PL)
Reliable Soldering in Power Electronics Manufacturing – Tutorial - with practical training (18 – 19 June 2008, Itzehoe, D)
Built-in Reliability into Power Electronic Systems – Workshop
(25 – 26 June 2008, Toulouse, F)
Automotive Power Electronics (EC Projects) – Seminar
(7 – 8 October 2008, Stuttgart, D)
Advanced Cooling Techniques (1st day)
Power PCBs and Busbars (2nd day) - – Workshop
(20 – 21 November 2008, Delft, NL)
Power Semiconductor Devices & Technologies – Tutorial
(4 - 5 Dec. 2008, Nuremberg, D)
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ECPE calendar of events 2008
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25 / 26 June 2008 |
ECPE Workshop ´Built-in Reliability into Power Electronic Systems´'###done |
| | 19 years ago Intel introduced the concept of buil¬ding-in reliability. It basically means to control design, processes and materials which are used for producing chips rather than testing the chip itself.
This concept is also very well suited to secure the reliability of power electronics systems. Today “zero defect” throughout the supply chain is a require¬ment. Everything has to be done right from the beginning, starting with the require-ments concerning reliability and mission profile.
After having worked out a first design the next step in the design process is “Virtual perfor-mance assessment” which includes electrical, thermal and EMI simulations. The results are compared with data sheets and standards. The fourth step is “Reliability assessment” based on the “physics of failure”, and physical models for Life-time prediction. The fifth step is “Robustness validation “, a brand new validation philosophy for components and modules/ ECUs, which has been worked out by many automotive industries under the umbrella of ZVEI, SAE, JSAE. The handbook J 1879 is available since 04/2007, and J1211 will be published 04/2008.
Prof. Eckhard Wolfgang (ECPE) will chair the workshop together with Michel Mermet-Guyennet, (PEARL) and Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of Workshop: Toulouse, France |
Programme
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18 / 19 June 2008 |
ECPE Tutorial ´Reliable Soldering for Power Electronics Manufacturing´'###done |
| | This two-day tutorial presents state-of-the-art lead-free soldering technology, addressing materials and design requirements with focus on high thermal demand assemblies as used in power applications of printed circuit board assemblies. The focus is laid on design for manufacturing and reliability of European environmental legislation (e.g. RoHS) compliant products. The interaction of design and process, heat transfer and temperature distribution must be accounted for with challenging new materials such as thick copper PCB. Thermal simulation helps to find out limits for the combination of PCB technology and solder process. Whereas the simulation always complements the time/temperature measurement for soldering applications, it helps to shorten the time to optimise profiling on reflow ovens, and enables restrictions for wave, and even more selective soldering with massive copper inlays or heat spreader already in the design phase.
Participants will practice temperature measurements and reflow simulation, production steps of reflow and wave soldering of SMD and Through-Hole test board assemblies on the LEADFREE training line at Fraunhofer ISIT. Basic simulation models will be shown useful in studies of voiding in solder joints in power modules in comparison to SMD power components. Finally, quality inspection by optical, x-ray, and acoustic microscopy equipment will be mediated to the participants on standard and high power designs.
Dr. Thomas Ahrens and Dr. Max Poech (Fraunhofer Institute ISIT) will chair the tutorial together with Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
The seminar aims on engineering level design, production, quality, and procurement personnel to give the materials and process background for a high quality and cost optimised view on power electronics production.
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| | Place of Tutorial: Itzhoe, Gemany |
Programme
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15 / 16 April 2008 |
ECPE Seminar ´Towards Energy Gain and Savings - Emerging Drives and Generator Systems´ ## |
| | Energy saving and improved energy efficiency is a major issue for drives and generator systems development. Power electronics technology is the key for energy efficient variable speed drives. Applications range from the low power area e.g. in home appliance over medium power in industrial and automotive up to the large MW power in the field of generation.
The main types of variable speed drives have been industrial drives where the competition between many players has been strong and pushed the technology to have a high power density with high performance at still a lower costs. New variable/adjustable speed generation technologies are key issue for improvement of electricity generation industry.
The ECPE Seminar is presenting some of these trends including emerging technologies and new applications. The goal of the seminar is to offer high level education and information exchange.
Prof. W. Koczara (Warsaw University of Technology) will chair the seminar together with Michel Arpilliere (Schneider Toshiba Inverter Europe) and Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of Seminar: Warsaw, Poland |
Programme
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8 / 9 April 2008 |
ECPE Tutorial ´EMC in Power Electronics´ ### done |
| | Advantages in semiconductor technology drive power electronics to higher efficiencies and compact systems designs. This progress comes along with increasing effort to comply with EMC requirements. Integration as a response to the market demands intensifies the challenges. With dense placement electromagnetic coupling between components raises influence on system behavior. The design become more complex and leads to significantly higher development costs.
The EMC in Power Electronics tutorial is a response to the increasing importance of EMC. It provides an overview on EMC phenomena and introduces methodologies to handle EMC questions. The tutorial is a supplement to the EMC seminar and intended for the training of young engineers and engineers from neighboring disciplines.
The course instructors of the EMC tutorial are Dr. Eckart Hoene, Fraunhofer Institute IZM, Germany and Dr. Jacques Laeuffer, France.
All presentations and discussions will be in English.
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| | Place of Tutorial: Helsinki, Finland |
Programme
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20 / 21 February 2008 |
ECPE Seminar ´Digital Power Conversion´ ### done |
| | Digital power is no longer a promise, but a commercial fact with many available products. The reasons for the market irruption are competitive cost compared to analog solutions and additional functionality at almost no extra cost. Additionally, international policies for energy saving, like Energy Star or European Codes of Conduct, can be more easily met using digital power. This may become a driving force for digital power adoption.
Digital power refers not only to the digital implementation of the control loop of a power converter, but also to the power management in its broader sense, including monitoring and fault detection, programming of the loop filter and control algorithm, tracking of output voltages, sequencing of different voltage rails, margining of power converters or remote maintenance.
Two main approaches can be distinguished: Fully digital controlled converters including closed loop control (driven by ICs or Microcontrollers) and digital managed analog or semi-digital contolled converters (complete modules which use digital techniques for control and/or power management). Attention needs also to be paid to the communication bus. Among the available alternatives, PMBus is becoming most popular, already adopted by the main players.
An increasing market transition from analog to digital power is foreseen in the near future, and this seminar brings some insight in the key digital control techniques.
Prof. José A. Cobos (Universidad Politécnica de Madrid) will chair the seminar together with Dr. Ulrich Kirchenberger (STMicroelectronics) and Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of Seminar: Munich, Germany |
Programme
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18 / 19 March 2008 |
ECPE Tutorial ´Reliability of Power Electronic Systems´ ### done |
| | The aim of the tutorial is to teach the basics of modern reliability engineering. This is based on physics-of-failure-concept and the intended mission profile of the electronic system and its components. The mission profile considers the combination of stresses versus time to which the electronic system is subjected during its application time. Especially application oriented end-of-life testing is under strong consideration today. This requires the design of appropriate accelerating stress tests. To secure reliability of power electronics systems the building-in reliability philosophy will be explained by examples.
Beside the very successful seminar series, ECPE is starting a tutorial programme focussing more on education of young engineers and engineers from neighbouring disciplines.
The course instructor of the reliability tutorial is
Prof. Dr. Eckhard Wolfgang
Co-instructors are
Dr. Wolfgang Gerling , Consultant
Dr. Eckart Hoene, Fraunhofer Institute IZM.
All presentations and discussions will be in English.
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| | Place of Tutorial: Coventry, United Kingdom |
Programme
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22 / 23 January 2008 |
ECPE Tutorial ´Reliability of Power Electronic Systems´ ### done |
| | The aim of the tutorial is to teach the basics of modern reliability engineering. This is based on physics-of-failure-concept and the intended mission profile of the electronic system and its components. The mission profile considers the combination of stresses versus time to which the electronic system is subjected during its application time. Especially application oriented end-of-life testing is under strong consideration today. This requires the design of appropriate accelerating stress tests. To secure reliability of power electronics systems the building-in reliability philosophy will be explained by examples.
Beside the very successful seminar series, ECPE is starting a tutorial programme focussing more on education of young engineers and engineers from neighbouring disciplines.
The course instructor of the reliability tutorial is Prof. Dr. Eckhard Wolfgang. Co-instructors are Dr. Uwe Drofenik, ETH Zurich and Dr. Wolfgang Gerling.
All presentations and discussions will be in English.
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| | Place of Tutorial: Zurich, Switzerland |
Programme
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22 / 23 November 2007 |
ECPE Seminar ´Passive Components in Power Electronics´ ### - done |
| | Power electronics is the key technology for effective power processing and distribution. In the past the main focus in the research areas in power electronics has been on active devices, both on power semiconductors and on the integration of control, protection and driving circuits with the main switches. Due to the already achieved progress in this field a further miniaturisation and increase in power conversion efficiency is more and more expected from the passive components and subassemblies.
The main goal of this seminar is to bring together experts from industry and university to present and discuss the current trends and the new developments related to the field of passive components. Improvements in the design of inductive and capacitive components can be expected from new materials and technologies, from innovative cooling concepts, but also from better understanding and improved analysis of the underlying loss mechanisms. Another challenging research area is the possibility of passive integration, e.g. by utilising parasitic components as part of the needed functionality or by integration of the components in substrate materials. The final part of this seminar deals with sub¬assemblies like filters, with interconnection problems and recent developments in PCB technology for high current applications.
Prof. Manfred Albach, Friedrich-Alexander-Universität Erlangen will chair the seminar together with Mr. Wolfgang Sammet (EPCOS) and Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of Seminar: Nuremberg, Germany |
Programme
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8 / 9 November 2007 |
ECPE Seminar ´Virtual Prototyping in Power Electronics´ - ### - done |
| | With the increasing requirements towards higher power density, efficiency and reliability, multi-domain modelling, analysis and design of power electronic systems will be of paramount importance to the industry in the future. Today, research and devel¬opment teams are mostly reliant on single-discipline software that does not allow for the simultaneously study of, e.g., electro-thermal or thermo-mechanical properties of a system. Furthermore, the electro¬magnetic effects and the high frequency losses in magnetic components and parasitics of inter¬connections can only be derived using FEM simu¬lation that requires high computational effort. This is also true for the study of conducted electromagnetic emissions and electromagnetic couplings, which can impair the performance of EMI filters at high frequen¬cies. Experimental analysis of such effects is involved and time consuming, and often does not allow the designer to arrive at an optimized solution and/or to ensure best in class performance, in a short design cycle time. Accordingly, the focus now is on the development of user-friendly, multi-discipline simu¬lation packages and design platforms that provide virtual prototyping capability, including also, e.g., the ability to estimate reliability.
In order to provide orientation at an early stage of this possible revolution in power electronic systems design, leading experts from academia, research institutions and software companies will present the state-of-the art in modelling of active and passive power components cooling systems and EMI, provide information on their first user-friendly, multi-disciplinary simulation platforms and will predict the expected future innovations in the field.
Prof. Johann W. Kolar (ETH Zurich) will chair the seminar together with Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of Seminar: Baden-Dättwil, Switzerland |
Programme
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6 / 7 September 2007 |
2nd ECPE SiC User Forum ´Potential of SiC in Power Electronic Applications´ |
| | After the first Silicon Carbide (SiC) User Forum organised by ECPE in 2006, technology has developed further - in particular new power electronic systems with SiC components and new SiC devices have been reported. Time has thus come to continue the exchange between experts involved in converter and device development: The second SiC User Forum will focus on typical power electronic systems the use of SiC is highly promising for -
i. e., electric drives, converters in transportation and power supplies; additionally an insight in recent material and device technology — which is the base for future system development — will be given. Renowned experts from all over the world have been invited to give an overview in keynotes, to in depth explain their research and development work in technical presentations and to share their knowledge in discussion forums as an indispensable part of the event.
The SiC User Forum is this way intended as a platform to share experience and ideas, to discuss and find out which power electronic systems are predestinated for usage of SiC and how to appropriately design-in those novel, almost ideal but also challenging components. It aims at finding and pointing out approaches to exploit the high potential of SiC and to support its beneficial introduction in power electronic systems.
SiC User Forum 2007 is scheduled to take place right after EPE conference 2007 in the Danish capital Copenhagen. Prof. Andreas Lindemann (Otto-von-Guericke-Universität Magdeburg, Germany) will chair the event together with Prof. Dr. Hiromichi Ohashi (National Institute of Advanced Industrial Science and Technology, Japan) and Mr. Thomas Harder (ECPE).
All presentations and discussions will be in English.
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| | Place of Seminar: Copenhagen, Denmark |
Programme
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2007 |
Seminar Programme 2007 |
| | We are pleased to present to you the Seminar Programme 2007. Again, we can offer up-to-date topics in power electronics, in cooperation with first class experts acting as Technical Chairmen.
• Energy Efficiency – the Role of Power Electronics (7 Feb. 2007, Brussels)
• Sensors in Power Electronics (14-15 March 2007, Erlangen/Nuremberg)
• Energy Storage Technologies (27-28 June 2007, Aachen)
• SiC User Forum II (6-7 Sept. 2007, Copenhagen)
• Virtual Prototyping in Power Electronics (19-20 Sept. 2007, Zurich)
• Passive Components in Power Electronics – Materials, Technologies, Trends (22-23 Nov. 2007, Nuremberg)
Furthermore, the ECPE Network will start a Tutorial Programme where the focus is put more on education of young engineers and career changers. A course instructor together with one or two co-speakers will give the tutorial for a small group of 15-25 participants. The ECPE Tutorial Series will be opened by an event on ´Reliability of Power Electronic Systems´ with Prof. E. Wolfgang as course instructor.
The ECPE Programme of Events 2007 will start with a European Workshop on Energy Efficiency organised in cooperation with EPE Association to be held on 7 February 2007 in Brussels, highlighting the role of power electronics in energy saving and improved energy efficiency, especially for the background of the starting 7th Framework Programme. The impact of power electronics in saving electrical energy will be discussed for several key applications e.g. for drives, lighting and power supplies.
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ECPE calendar of events 2007
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27 / 28 June 2007 |
ECPE Seminar ´Energy Storage Technologies´ ### done |
| | Energy storage systems become more and more important in various applications. Presently, the introduction of storage systems in hybrid electric vehicles and in power grids is widely discussed. Thus, in-depth knowledge on the availability and the technology of storage systems is essential for designing future innovative solution. But, storage systems of any kind will be always integrated into the application via power electronics. Power electronics is responsible for power transfer from and to the storage technology including efficient charging strategies but beyond this basic function they have additional functions and impact. Additional functions are mainly those which give added value to the power quality of the grid or the end user such as supplying reactive power or compensation of flickers and harmonics. But also the harmonics and ripples from the power electronics affect the lifetime of the storage systems and are therefore of great relevance.
This seminar bridges the world of power electronics and the world of storage systems. Finally, energy storage systems are always a combination of the storage technology itself and the power electronic interface which finally defines its properties with regard to the application. This seminar is focusing on storage systems in vehicles and in modern power grids. Invited experts on storage technologies, power electronics and applications will present the challenges and opportunities for storage systems with a clear focus on the interfaces between storage technologies, power electronics and applications.
The seminar will be held in Aachen and is organised by ECPE and Institute for Power Electronics and Electrical Drives / RWTH Aachen University.
All presentations and discussions will be in English.
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| | Place of Seminar: Aachen, Germany |
Programme
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20 / 21 June 2007 |
ECPE Tutorial and Training ´Leadfree Soldering for Power Electronics Manufacturing´ - ### |
| | This two-day tutorial presents state-of-the-art lead-free soldering technology, addressing materials and design requirements with focus on high thermal demand assemblies as used in power applications of printed circuit board assemblies. After implication of the European environmental legislation, the focus is now laid on design for manufacturing and reliability of RoHS compliant products. The interaction of design and process, heat transfer and temperature distribution must be accounted for with challenging new materials such as thick copper PCB. Thermal simulation helps to find out limits for the combination of PCB technology and solder process. Whereas the simulation always complements the time/temperature measurement for soldering applications, it helps to shorten the time to optimise profiling on reflow ovens, but lessens hopes to find suitable settings for wave, let alone selective soldering with massive copper inlays or heat spreader.
Participants will be enabled to practice temperature measurements and reflow simulation, production steps of reflow and wave soldering of SMD and Through-Hole test board assemblies on the LEADFREE training line at Fraunhofer ISIT. Basic simulation models will be shown useful in studies of voiding in solder joints in power modules in comparison to SMD power components. Finally, quality inspection by optical, x-ray, and acoustic microscopy equipment will be mediated to the participants on standard and high power designs.
Dr. Thomas Ahrens and Dr. Max Poech (Fraunhofer Institute ISIT) will chair the tutorial together with Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of Tutorial: Itzehoe, Germany |
Programme
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19 / 20 April 2007 |
ECPE Tutorial ´Reliability of Power Electronic Systems´ ### done |
| | The aim of the tutorial is to teach the basics of modern reliability engineering. This is based on physics-of-failure-concept and the intended mission profile of the electronic system and its components. The mission profile considers the combination of stresses versus time to which the electronic system is subjected during its application time. Especially application oriented end-of-life testing is under strong consideration today. This requires the design of appropriate accelerating stress tests. To secure reliability of power electronics systems the building-in reliability philosophy will be explained by examples.
Beside the very successful seminar series, ECPE is starting a tutorial programme focussing more on education of young engineers and engineers from neighbouring disciplines.
The course instructor of the reliability tutorial is Prof. Dr. Eckhard Wolfgang. Co-instructors are Dr. Uwe Drofenik, ETH Zurich and Dr. Wolfgang Gerling.
All presentations and discussions will be in English.
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| | Place of Tutorial: Nuremberg, Germany |
Programme
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14/15 March 2007 |
ECPE Seminar ´Sensors in Power Electronics´### done |
| | Increasing demands on accuracy, dynamic response and temperature range together with the trend towards reduced mounting space, system integration and cost pressure are challenging sensors in power electronics.
Scope of the seminar:
Current Sensors
• physical sensor principles
• high current sensors
• high temperature
Temperature Sensors:
• overview and case studies
Position and Torque Sensors:
• overview and applications
Cross functional aspects cover high operation temperature, accuracy and reliability of sensors.
The goal of the seminar is to offer high level education and expert discussions. The seminar will start with an extended presentation from Dr. R.D. Lorenz (University of Wisconsin-Madison/Center for Power Electronics Systems, USA) on sensors in power electronic systems. The seminar is practically oriented and aims to convey specific technical information to the participants.
Dr. Martin März (Fraunhofer IISB, Erlangen/Nuremberg) will chair the seminar together with Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of seminar: Erlangen, Germany |
Programme
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7 February 2007 |
ECPE European Workshop ´Energy Efficiency - the role of Power Electronics´ |
| | One key topic in society, on the European level and globally, is energy saving and improved energy efficiency. The role of power electronics for the energy efficiency will be highlighted in a European Workshop organised by ECPE European Center for Power Electronics in cooperation with EPE Association.
Objectives:
- show the energy saving potential of power electronics in key applications e.g. for drives, lighting and power supplies
- inform on planned topics in FP7 referring to power electronics, especially in energy efficiency
- show R&D needs in power electronics to improve energy efficiency: examples and visions
- demonstrate the importance of power electronics in saving electrical energy as a key and enabling technology
- prepare research proposals: R & D needs and research directions
The workshop is chaired by Prof. Dr. L. Lorenz (Infineon Technologies and President of ECPE e.V.).
The Co-Chairman from the EPE Association is Prof. Dr. Ph. Mawby (University of Warwick). All presentations and discussions will be in English.
Place of seminar: Brussels, Belgium
The 18 pages Position Paper is available now:
Download the pdf-file
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view all presentations (16 MB !!!)
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9 / 10 Nov. 2006 |
ECPE Seminar ´High Temperature Electronics and Thermal Management´ ### done |
| | The general trend towards increasing power density of power electronics systems yields to major consequences:
- the surface for heat exchange to ambient is reduced,
- therefore, the temperature of the components rises,
- the reliability of components and interconnects decreases.
In addition more and more applications require to operate power electronics at ambient temperatures above 120°C, like in automotive, aerospace, and lighting applications.
Component manufacturers are aware of this trend and are providing “high temperature” solutions. In any case, however, thermal management has to be optimized.
The seminar aims for describing the state of the art of silicon high temperature power devices and electronics. SiC-electronics will not be treated because of the ECPE SiC User Forum held March 2006. The major part of the Seminar will deal with thermal management where all aspects of materials and methods known and available will be discussed. This is done by case studies as well as basic information necessary to work out practical solutions.
Prof. Eckhard Wolfgang (Siemens Corporate Technology, Munich) will chair the seminar together with Mr. Dave Saums (DS&A Consultants, USA) and Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
Place of Seminar: Nuremberg, Germany
Presentations from Dr. Rittner and Dr. Biela available as download |
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Presentations Dr. Rittner and Dr. Biela
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14 / 15 September 2006 |
ECPE Seminar & Training ´LEADFREE Soldering for Power Electronics Manufacturing´ ### done |
| | This two-day seminar presents state-of-the-art lead-free soldering production technology, addressing materials and design specialties with focus on high thermal demand assemblies as used in power applications. The current European legislation requirements will be discussed briefly as necessary to recognize impact of RoHS, WEEE and EUP on power electronic products. To show interaction of product and process, heat transfer and temperature distribution will be demonstrated in measurement and simulation for soldering applications to optimise reflow soldering machine settings before going to the equipment. An example explores further the impact of copper distribution on wave soldering. Participants will be enabled to perform temperature measurements and reflow simulation themselves. In scope is determination of the production steps of reflow and wave soldering of SMD and Through-Hole test board assemblies on the LEADFREE training line at Fraunhofer ISIT. Basic simulation models will be shown useful in studies of voiding in solder joints in power modules in comparison to SMD power components. Finally, quality inspection by optical, x-ray, and acoustic microscopy equipment will be mediated to the participants on standard and high power designs.
Dr. Thomas Ahrens and Dr. Max Poech (Fraunhofer Institute ISIT) will chair the seminar together with Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of seminar: Itzehoe, Germany |
Programme
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2006 |
Seminar Programme 2006 |
| | We are pleased to present the Seminar Program 2006. The ECPE Program 2006 starts with the following events:
- ECPE Seminar ´Renewable Energies´,
Techn. Chairman: Prof. F. Blaabjerg, Aalborg
University, hosted by ISET e.V.
(Prof. P. Zacharias)
9/10 February 2006 in Kassel - Germany
- ECPE Seminar ´SiC User Forum - Potential of SiC
in Power Electronics Applications´,
Techn. Chairman: Prof. A. Lindemann,
University Magdeburg
14/15 March 2006 in Nuremberg
(part of the ECPE Annual Event 2006)
- ECPE Annual Event 2006, 14 - 16 March 2006
General Meeting of ECPE e.V. with table-top
exhibition of ECPE Competence Centers and
meeting of the Power Electronics Technology
Roadmaps teams
For the ECPE calendar of events with the seminar topics and dates, please see the pdf. Furthermore, the calendar includes the dates of the ECPE Annual Event 2006 and three other European Power Electronics Conferences with ECPE involvement. Every single seminar program will be available for downloading on our homepage approx. 6 weeks in advance to the event.
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ECPE calendar of events 2006
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3 / 4 July 2006 |
ECPE Seminar ´EMC in Power Electronics´ ### already done !!! |
| | Power electronics has evolved by steps due to technology and methodology improvements but under the constant pressure of the market. Unfortunately increasing power ratings and very high switching frequencies have created undesirable couplings inside the power systems. Design of power systems became complex and electro-magnetic standards do not help an already complex situation. Integration is a response to the market requirements for cheaper commutated watts, but it stresses electro-magnetic couplings inside the system. Electro-magnetic compatibility (EMC) is a scientific domain and covers a lot of issues, as important as thermal issues for example.
The seminar wishes to address four topics, and share the experience acquired with industrial applications and academic studies.
• EMC and Integration: integration changes the system behavior with regard to EMC.
• EMC and drives: some experiences related to modern drive applications.
• EMC and embedded network: power electronics is invading autonomous systems like cars, planes or boats. The mobile nature of these systems renders EMC problems specificly.
• EMC and design, simulation and measurements: some technical and technological solutions to solve the prediction of EMI through simulation and the possibilities to experimentally verify these estimations.
Prof. Bruno Allard (ISP3D) will chair the Seminar together with Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of seminar: Grenoble, France |
Programme
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14 / 15 March 2006 |
SiC User Forum - Potential of SiC in Power Electronic Applications ### already done !!! |
| | Although long-awaited Silicon Carbide devices nowadays are in production, their large-scale application in power electronic converters still seems to take time. This is the motivation of ECPE to arrange a SiC User Forum: It is intended as a platform to share ideas and experience, to discuss and find out which power electronic systems are predestinated for usage of SiC – i. e. where it leads to major advantages – and how to appropriately design-in those novel, almost ideal but also challenging components.
The program of the User Forum comprises technical presentations of renowned experts in the field, covering various typical applications where SiC converters are currently or might in near future be introduced. This topic is complemented with device and circuit related presentations, giving a technological insight into the back¬grounds relevant for the aforementioned system designs. Forum sessions offer the opportunity to in depth discuss with the speakers and additional invited experts, aiming at approaches to exploit the high potential of SiC and supporting its beneficial introduction in power electronic systems.
Prof. Andreas Lindemann (Otto-von-Guericke-Universität Magdeburg, D) will chair the User Forum together with Mr. Thomas Harder (ECPE). All presentations and discussions will be in English.
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| | Place of seminar: Nuremberg, Germany |
Report of Conclusions
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9 / 10 February 2006 |
ECPE Seminar ´Renewable Energies´ ### already done !!! |
| | The global energy prices on fossil fuels have increased drastically in the last years. Alternative energy sources like wind, sun, wave and biofuels are becoming very interesting in terms of cost and also as a more long term solution for the total energy demand. In almost all renewable energy systems the power electronics technology is an enabling and necessary technology, which interconnects the electrical power production to the grid and optimizes the power generation from the renewable energy source.
This ECPE seminar will especially focus on the two most emerging renewable energy technologies – Wind Power and Sun. It will discuss the technology itself, the necessary power electronics, the grid interconnection and how to control the overall grid structure. Finally, other perspective technologies will be presented. The seminar will be hosted by ISET in Kassel and the second day will be ended with a tour in ISET.
Specialists in the field are invited to give overviews and in-depth lectures.
All presentations and discussion will be in English.
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| | Place of seminar: Kassel, Germany |
Seminar Flyer
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15 / 16 September 2005 |
ECPE Seminar ´Power Supplies´ ### already done !!! |
| | The application area of power supplies ranges widely from powering IT, telecom and control systems to medical diagnostics and surgical equipment, audio systems, lighting applications, home appliances etc. to industrial process technology like electric welding, laser systems and induction heating. In the future also power supplies for automotive systems and more-electric aircraft as well as utility interfaces for renewable energy, fuel-cell power and micro turbines will gain significant importance. Compared to the state-of-the-art in all fields a higher functionality, higher power density and higher energy conversion efficiency will be required at reduced costs.
This ECPE Seminar will focus on the future challenges and discuss advanced technologies for key applications of power supplies. An overview of recent activities of the European industry and of new technologies emerging from European university research will be presented including. The Seminar will be opened with a tutorial from Dr. F.C. Lee, Director of the CPES (Center for Power Electronics Systems, USA), on the vision and technical realization of an integrated system approach via integrated active and passive power electronics modules (IPEMs). The Seminar is practically oriented and aims to convey specific technical information to the participants.
Prof. Johann W. Kolar (ETH Zurich, CH) will chair the seminar together with Mr. Thomas Harder (ECPE). All presentations and discussion will be in English
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| | The seminar took place in Dresden/Germany |
here are some photos from the seminar
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27 / 28 April 2005 |
ECPE- -Seminar ´Advanced Power Conversion Concepts for Motor Drives´ ### already done !!! |
| | Technical Chair: Prof. F. Blaabjerg, Aalborg University
The seminar is held in English.
The power electronics technology is necessary for adjustable speed drives (ASD) and in the last 30 years the development has been significant. The key drivers are energy saving, automation and transport systems. New applications are becoming attractive too like automotive systems, renewable energy systems and last but not least the appliance systems. The main types of adjustable speed drives have been industrial drives where the competition between many players has been strong and pushed the technology to have a high power density with high performance with still a lower price. Also regulations for EMC have strengthened the drive system in a still harsher environment. This ECPE seminar will focus on power conversion technology for different key applications of adjustable speed drives and discuss it in a component and system context.
We are presenting some of these trends including emerging technologies and new applications. The goal of the seminar is to offer high level education and information. The presentations include tutorials, where some new issues are discussed in detail, and shorter technical papers that convey state-of-the-art technical information.
Prof. Frede Blaabjerg (Aalborg University, DK) will chair the seminar together with Mr. Thomas Harder (ECPE). All presentations and discussion will be in English.
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| | Place of seminar: Aalborg (Denmark) |
seminar flyer
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