ECPE co-sponsored Conferences


  ECPE Calendar: Power Electronics Conferences & Events

                      ECPE Calendar_PE Conferences and Events.pdf

                              ECPE Tutorials and Workshops you can find here.

September
2017

ESREF - European Symposium on Reliability of Electron
Devices, Failure Physics and Analysis

25 - 29 September 2017
Cité Mondiale du Vin Bordeaux / France

ESREF 2017 will be held in Bordeaux – This South West French major town is the European capital for optical and laser engineering, with the so called “ Laser Mégajoule”, one of the most powerful lasers in the world.

Some of the largest companie involved in aeronautic and aerospace industry are located around Bordeaux. Dassault Falcon series private jets are built there as well as the French military aircraft Rafale; the Airbus A380 cockpit, the boosters of Ariane 5
Bordeaux is located at the very heart of Southern Europe. It is part of the UNESCO World Heritage List, and classified as "City of Art and History”.
The University of Bordeaux is leading the “Initiative of Excellence” (Idex) program in association with national research organizations and higher educational institutes. 53 000 students take benefit of the multidisciplinary and international framework of the "Investments for the Future" program.

Hosting ESREF 2017 in this rich environment is a great opportunity since reliability in these particular applications is a very hot topic with strong challenges such as zero ppm failure and harsh environments.
For this 28th edition, in addition to the core topics of the conference, we would like to involve the major actors of aeronautics, space and embedded systems industry to provide specific topics such as radiation hardening, very long-term reliability, high/low temperature challenges, obsolescence and counterfeit issues, wide band gap power devices for the more electric aircraft and other embedded system applications.

We are looking forward to welcoming you for a memorable experience!


ESREF 2017 Website

September
2017

LpS - LED professional Symposium + Expo

26 - 28 September 2017
Bregenz / Austria

The 7th International LpS event in Bregenz, Austria is Europe’s leading lighting conference. The LpS 2017 event will emphasize “Smart Technologies for Lighting Innovations” and cover the latest trends in application areas. Transfer of technological know-how in a truly global scale, international speakers of the highest grade of expertise, attendees & exhibitors from 50+ countries.

 

Application areas covered: Human Centric Lighting, Indoor Lighting, Outdoor Lighting, Automotive/Transportation Lighting, Architectural Lighting, Signage Lighting, Stage Lighting, Museum Lighting, Horticultural Lighting and Medical Lighting

 

The event will take place at the Festspielhaus Bregenz on 26th-28th of September, 2017.

 

LpS 2017 Website

October
2017

International Symposium POWER ELECTRONICS Ee2017

19 - 21 October 2017
Novi Sad / Republic of Serbia

Continuing tradition of 44 years, Power Electronics Society from Novi Sad, Institute “Nikola Tesla” from Belgrade, Faculty of Technical Sciences of the University of Novi Sad are organizing the 19th International Symposium POWER ELECTRONICS Ee2017.

The purpose of the symposium is to provide a forum for presentation and discussion of the state-of-art of Power electronics and related areas. Submitted papers should not have been previously published and should present theoretical or experimental research results as well as results of application of developed methods in engineering practice, presentation of engineering solutions and devices, practical experience in power electronic devices exploitation etc.

Ee2017 Website

October/
November
2017

Modern Power Semiconductors and their packaging

31 October - 03 November 2017
Aalborg / Denmark

Center of Reliable Power Electronics (CORPE) at Aalborg University keeps disseminating the culture of reliability worldwide. This course presents the fundamentals of power switches operations from a physical point of view, together with an overview on different packaging technologies and their properties, advantages and disadvantages. The driving lines throughout the course are the requirements from the real applications and possibilities to tackle them both from the semiconductor and the package points of view.

Three parts:
I) semiconductor theory
II) packaging theory
III) Exercise

Programme

December
2017

EDPC - International Electric Drives Production Conference and Exhibition

05 - 06 December 2017
Wuerzburg / Germany

Increasing power consumption, CO2 reduction, growing mobility or progressing automation – none of these future megatrends is possible without powerful electric drives. The electrification of the automobile powertrain is considered crucial, as the whole sector is facing difficulties resulting from the substitution of the conventional combustion engine. Besides advancing ideas on the design of powerful electric drives, the organization of the manufacturing processes and systems is of great importance. 

The 7th International Electric Drives Production Conference offers an outstanding platform for the exchange of experiences for developers, researchers and potential users. 

The focus of the conference is set on the presentation of highly innovative products from various industries as well as manufacturing processes and strategies. Following the conference, there will be an industrial exhibition, a poster presentation and an accompanying program.

EDPC 2017 Website

January/
February
2018

iMaps - European Advanced Technology Workshop on
Micropackaging and Thermal management - CALL FOR PAPERS

31 January - 01 February 2018
La Rochelle / France

CALL FOR PAPERS
Call Deadline: 12 October 2017

The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.

Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems.

Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also greater reliability; these trends also require improvements and changes in packaging and thermal materials.  

Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels. 

iMaps 2018 Website
Call for Papers

February
2018

IEEE ICIT - International Conference on Industrial Technology - CALL FOR

PAPERS

20 - 22 February 2018
Lyon / France

CALL FOR PAPERS
Call Deadline: 15 October 2017

IEEE ICIT 2018 will be held in Lyon, France, from February 20th to 22th, 2018, at the Lyon convention center and will be devoted to meet leading scientists, experts, managers and order givers to germinate new ideas to give birth to the research activities that will create our future.

The 19th edition of the conference follows the footsteps of the previous meeting in order to promote technological activities. The topics of the conference include technologies for electric transportation, electrical energy storage systems, mechatronics, power electronics, power systems and grids, renewable energy systems, electrical machines and drives, energy management and HVDC super grid, sensors, actuators, micro-nanotechnology, electronic system on chip and embedded control, medical and healthcare robotics and automation, intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, cloud computing, big data and software engineering, vision systems, 3D printing.

IEEE ICIT 2018 Website
Call for Papers

March
2018

CIPS - International Conference on Integrated Power Electronics
Systems

20 - 22 March 2018
Stuttgart / Germany

The 10th International Conference on Integrated Power Electronics Systems (CIPS 2018) brings together engineers coming from academia and industry involved in Component development, System development, Research and Reliability engineering.

 

The 10th International Conference on Integrated Power Electronics Systems (CIPS 2018) covers topics such as:
:: Application of integrated PE systems
:: Mechatronic systems
:: Packaging
:: High and medium power modules
:: Reliability
:: Components
:: Design and Test Tools

 

CIPS 2018 Website

April
2018

PEMD - International Conference on Power Electronics, Machines
and Drives

17 - 19 April 2018
Liverpool / United Kingdom

PEMD is a popular three-day conference that brings together hundreds of power electronics, machines and drives specialists from around the world to deliver the latest developments in the technologies and applications of electrical drives, machines and power electronic systems.

 

This is your chance to present your latest research results, innovative application or operational advances to the 450 strong audience of expert industrial representatives and academia.

 

Take advantage of a presentation slot in the conference programme and receive significant and unparalleled publication opportunities.

 

PEMD 2018 Website

June
2018

PCIM Europe - Power Conversion and Intelligent Motion - CALL FOR PAPERS

05 - 07 June 2018
Nuremberg / Germany

CALL FOR PAPERS
Call deadline: 16 October 2017 

PCIM Europe (Power Conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management.

International exhibitors inform visitors in three exhibition halls about the newest products, trends and developments in the power electronics industry. PCIM Europe is the forum for technologies for the whole value chain of the power electronics industry, from the components to the intelligent system.

As a visitor of PCIM Europe, you will experience new trends and developments in power electronics in the making and gain a unique, global market overview.

In addition to the exhibition visit, a participation in the globally recognized conference of PCIM Europe will be worth your while. Look forward to more than 300 gripping presentations on current research and development topics, all of them initial publications.

 

PCIM Europe 2018 Website
ECPE Joint Stand at PCIM Europe 2018
Call for Papers

September
2018

EPE - ECCE EUROPE

17 - 21 September 2018
Riga / Latvia

It is our pleasure to announce that the 20th Conference on Power Electronics and Applications, EPE’18 ECCE Europe, will take place in Latvia, from the 17 to 21 September 2018.

 

EPE 2018 Website

September
2018

ESTC - Electronics System-integration Technology Conference - CALL FOR
PAPERS

18 - 21 September 2018 
Dresden / Germany

CALL FOR PAPERS
Call Deadline: 15 February 2018

The 7th ESTC 2018 will be held from September 18th to 21st, 2018, in The Westin Bellevue Dresden Hotel, in Dresden, Germany. ESTC 2018 will be organized by the TU Dresden, the Institute for Electronics Packaging and the Center of Microtechnical Manufacturing. 

 

ESTC 2018 Website
Call for Papers

October
2018

ESREF - European Symposium on Reliability of Electron
Devices, Failure Physics and Analysis

01 - 05 October 2018
Aalborg / Denmark

I am proud to announce the twenty-ninth European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2018, to be held in Aalborg, Denmark.

This international symposium will continue its almost 30-year history of focusing on the latest research developments and future directions in failure analysis, quality and reliability of materials, devices and circuits for micro-, opto-, power and space electronics. It historically provides an unpaired European forum to develop all aspects of reliability, including management and advanced analysis techniques for present and emerging semiconductor applications. Hence, all aspects of specification, technology and manufacturing, test, control and analysis will be addressed.

 

ESREF 2018 Website