ECPE Young Engineer Award at CIPS Conference

2016

ECPE Young Engineer Award at CIPS Conference 2016

The winner of the Young Engineers Award at CIPS Conference 2016 sponsored by ECPE is:
:: Daniel Kearney (ABB Corporate Research Centre 
   & ABB Schweiz AG)
: His paper is about "PCB Embedded
   Power Electronics for Low Voltage Applications".

2014

ECPE Young Engineer Award at CIPS Conference 2014

The Young Engineers Award at CIPS Conference 2014 sponsored by ECPE was split between two winners:
:: Bianca Böttge (Fraunhofer IWM): The title of her paper is
   “High Resolution failure analysis of silver-sintered contact
   interfaces for power electronics”.
:: Dr. Christian R. Müller (Infineon): His paper is about “Low-
   inductive Inverter concept by 200A/1200V half bridge in
   EasyPack 2B – following strip-line design”.

2012

ECPE Young Engineer Award at CIPS Conference 2012

The winners of the Young Engineers Award at CIPS Conference 2012 sponsored by ECPE are:
:: Silke Kraft (Fraunhofer IISB). Her paper is about
   'Reliability of Silver Sintering on DBC and DBA Substrates
   for Power Electronic Applications'.
:: Gernot J. Riedel (ABB Switzerland Corporate Research).
  
The title of his paper is  'Reliability of Large Area Solder
   Joints within IGBT Modules: Numerical Modelling and
   Experimental Results'.

2010

ECPE Young Engineer Award at CIPS Conference 2010

The winner of the Young Engineers Award at CIPS Conference 2010 sponsored by ECPE is Jens Göhre (Fraunhofer IZM). His paper is about 'Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling Measured by the Shear Test'.